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  • TI推出采用CapTIvate™技术的MSP430™微控制器(MCU)系列产品

    TI推出采用CapTIvate™技术的MSP430™微控制器(MCU)系列产品

    TI近日推出采用CapTIvate™技术的MSP430™微控制器(MCU)系列产品,为成本敏感型应用带来电容式感应功能。开发人员可以利用带集成电容式触摸的新型MSP430FR2512和MSP430FR2522 MCU,为工业系统、家庭自动化系统、家电、电动工具、家庭娱乐、个人音频应用等增加多达16个按钮以及接近感应功能。   新型电容式触摸MCU的主要特性和优势 l 可靠、优化的性能:MSP430FR2512和MSP430FR2522 MCU可为暴露于电磁干扰、油、水和油脂的应用提供经国际电工委员会(IEC)61000-4-6认证的电容式感应MCU解决方案。新型MCU的功耗比竞争产品低五倍,支持接近感应和透过玻璃、塑料和金属覆盖层触摸。 l 用于成本敏感型应用的电容式触摸MCU:TI的CapTIvate技术将电容式触摸和接近感应的优势性能增加到门禁控制面板、灶具、无线扬声器和电动工具等应用中。 l 缩短上市时间:开发人员可以使用与CapTIvate编程器板(CAPTIVATE-PGMR)或TI LaunchPad™开发套件兼容的新型BOOSTXL-CAPKEYPAD BoosterPack™插件模块快速评估其应用的电容感应。 BoosterPack模块加入CapTIvate设计中心和在线CapTIvate技术指南中的一系列MCU、易于使用的工具、软件、参考设计和文档。此外,开发人员可以加入德州仪器在线支持社区,寻找解决方案,获得帮助,凭借CapTIvate技术加速开发。 封装和供货 MSP430FR2512和MSP430FR2522 MCU的批量生产采用20引脚超薄四方扁平无引线(VQFN)封装和16引脚薄型紧缩小外形封装(TSSOP)。 CapTIvate BoosterPack插件模块(BOOSTXL-CAPKEYPAD)通过TI商店和授权经销商供应。

    时间:2020-07-29 关键词: TI MCU

  • 低功耗无线PIR运动检测参考设计--TIDA-01476解决方案

    低功耗无线PIR运动检测参考设计--TIDA-01476解决方案

    TI公司的TIDA-01476是低功耗无线PIR运动检测参考设计,能创建工业传感器到云端节点,连接到IoT网络网关和云数据提供者.参考设计采用微功耗运放,比较器和SimpleLink™超低功耗小于1GHz无线微控制器(MCU)平台等器件,以形成超低功耗传感器-云运动检测器,具有超长电池寿命和不需要连线.连接长度高达1000米,满足IEEE 802.15.4e/g标准,主要用在运动检测,照明传感器,无线控制和建筑物自动化.本文介绍了参考设计TIDA-01476主要特性和系统指标,框图,电路图,材料清单和PCB设计图. The TIDA-01476 reference design demonstrates howto create an industrial sensor-to-cloud end nodecapable of connecting to an IoT network gateway andcloud data provider. This design uses TexasInstruments’ nano-power operational amplifiers,comparators, and the SimpleLink™ ultra-low-powerSub-1 GHz wireless microcontroller (MCU) platform todemonstrate an ultra-low-power sensor-to-cloudmotion detector, leading to extremely long battery lifeand no required wiring. This reference design demonstrates how to create an industrial sensor-to-cloud end node capable of connecting to an IoT network gateway and cloud data provider. This design uses Texas Instruments’ nano-power operational amplifiers, comparators, and the SimpleLink™ ultra-low-power Sub-1 GHz wireless microcontroller (MCU) platform to demonstrate an ultra-low-power sensor-to-cloud motion detector, leading to extremely long battery life and no required wiring. Many industrial and building automation systems use motion detectors to control different functions basedon human presence, such as lighting, for achieving higher efficiency of those functions by turning them offwhen not needed. Additionally, these systems require increasing numbers of wireless sensor nodes toreduce the installation costs and the make the systems more flexible for future expansion by eliminatingwiring. However, one of the major limitations for a large wireless network is power. Because thesesystems are battery powered, the maintenance cost associated with periodic battery replacement can become prohibitive. Depending on the power consumption and battery configuration, typical batterypoweredPIR motion detectors can run anywhere from four to seven years before the batteries need to bereplaced. Enabled by Texas Instruments ’nano-power amplifiers, comparators, and the SimpleLink ultra-low-powerwireless MCU platform, the Low-Power Wireless PIR Motion Detector Reference Design demonstrates amotion detector circuit solution requiring no wiring while also fully maximizing the battery life. At a high level, this TI Design consists of a CR2032 coin cell battery, two nano-power op amps, two nanopowercomparators, an ultra-low-power wireless MCU, and a PIR sensor with analog signal output. Thetwo op amps form an amplified band-pass filter with a high-input impedance, which allows it to beconnected directly to the sensor without loading it. The two comparators form a window comparator, whichis used to compare the amplified sensor output to fixed reference thresholds so that motion can bedistinguished from noise. The two outputs of the window comparator then serve as interrupts to the wireless MCU. This way, the MCU can operate in its lowest power sleep mode during times where there isno motion being detected and only wakes up to send messages back to a remote host when motion hasbeen detected. Due to the nano-amp operation of the analog signal chain components, this TI Designachieves a 10-year battery life from a single CR2032 coin cell battery. This design guide addresses component selection, design theory, software and the testing results of thisTI Design system. The scope of this design guide gives system designers a head-start in integrating TI’snano-power analog components, and the SimpleLink ultra-low-power wireless MCU platform along with astarting point for sensor-to-cloud software integration. 参考设计TIDA-01476主要特性: • Large Network-to-Cloud Connectivity EnablingLong Range, Up to 1 km (Line of Sight) • IEEE 802.15.4e/g Standards-Based Sub-1 GHzSolution With TI 15.4-Stack • Use of Nano-Power Analog for Ultra-Low-PowerDesign, Resulting in 10-Year Battery Life FromSingle CR2032 Coin Cell • Low Standby Current of 1.65 μA (PIR SensorRemains Active in Standby) • Interrupt Driven Sub-1 GHz WirelessCommunication of Motion for Increased Power Savings • Motion Sensitivity up to 30 ft 参考设计TIDA-01476应用: • Motion Detection • Lighting Sensors • Wireless Controls • Building Automation 图1.参考设计TIDA-01476外形图 参考设计TIDA-01476主要系统指标: 图2.无线PIR系统框图 图3.低功耗无线PIR运动检测器参考设备硬件描述 图4.参考设计TIDA-01476电路图(1) 图5.参考设计TIDA-01476电路图(2) 图6.参考设计TIDA-01476电路图(3) 参考设计TIDA-01476材料清单: 图7.参考设计TIDA-01476 PCB图 图8.参考设计TIDA-01476 PCB设计图(1) 图9.参考设计TIDA-01476 PCB设计图(2) 图10.参考设计TIDA-01476 PCB设计图(3) 图11.参考设计TIDA-01476 PCB设计图(4) 图12.参考设计TIDA-01476 PCB设计图(5) 图13.参考设计TIDA-01476 PCB设计图(6) 图14.参考设计TIDA-01476 PCB设计图(7) 图15.参考设计TIDA-01476 PCB设计图(8) 详情请见: 和 以及 与 tiduda8.pdf tidrs11.pdf tidrs12.pdf

    时间:2020-07-28 关键词: TI 无线

  • TI TIDA-01425带以太网和CAN的汽车网关参考设计

    TI TIDA-01425带以太网和CAN的汽车网关参考设计

    TI公司的TIDA-01425是基于DRA710信息娱乐应用处理器的带以太网和CAN的汽车网关参考设计,具有100BASE-T1汽车以太网,100BASE-TX和CAN PHYs,可以通过冷启动,抢跑和甩负荷等方式工作,降低EMI功率级和电池接反保护,能增加带宽和网关的处理能力,主要用在应用处理器模块,汽车网关,构建设备控制单元,自由空间传感器,铁路运输马达控制以及车辆乘员检测传感器.本文介绍了DRA710信息娱乐应用处理器主要特性和框图,汽车网关参考设计TIDA-01425主要特性,框图,电路图,材料清单和 PCB设计图. The DRA71x processor is offered in a 538-ball, 17&TImes;17-mm, 0.65-mm ball pitch (0.8mm spacing rules canbe used on signals) with Via Channel™ Array (VCA) technology, ball grid array (BGA) package.The architecture is designed to deliver high-performance concurrencies for automotive applications in acost-effective solution, providing full scalability from the DRA75x ("Jacinto 6 EP" and "Jacinto 6 Ex"),DRA74x "Jacinto 6" and DRA72x "Jacinto 6 Eco" family of infotainment processors, including graphics,voice, HMI, multimedia and smartphone projection mode capabilities. Programmability is provided by a single-core ARM Cortex-A15 RISC CPU with Neon™ extensions and aTI C66x VLIW floating-point DSP core. The ARM processor lets developers keep control functionsseparate from other algorithms programmed on the DSP and coprocessors, thus reducing the complexityof the system software. Additionally, TI provides a complete set of development tools for the ARM, and DSP, including Ccompilers and a debugging interface for visibility into source code execution.The DRA71x Jacinto 6 Entry processor family is qualified according to the AEC-Q100 standard.The device features a simplified power supply rail mapping which enables lower cost PMIC solutions. DRA710主要特性: • Architecture Designed for InfotainmentApplications • Video, Image, and Graphics Processing Support – Full-HD Video (1920 × 1080p, 60 fps) – Multiple Video Input and Video Output – 2D and 3D Graphics • ARM® Cortex®-A15 Microprocessor Subsystem • C66x Floating-Point VLIW DSP – Fully Object-Code Compatible With C67x andC64x+ – Up to Thirty-two 16 × 16-Bit Fixed-PointMultiplies per Cycle • Up to 512KB of On-Chip L3 RAM • Level 3 (L3) and Level 4 (L4) Interconnects • DDR3/DDR3L Memory Interface (EMIF) Module – Supports up to DDR-1333 (667 MHz) – Up to 2GB Across Single Chip Select • Dual ARM® Cortex®-M4 Image Processing Units(IPU) • IVA-HD Subsystem • Display Subsystem – Display Controller With DMA Engine and up toThree Pipelines – HDMI™ Encoder: HDMI 1.4a and DVI 1.0Compliant • 2D-Graphics Accelerator (BB2D) Subsystem – Vivante™ GC320 Core • Video Processing Engine (VPE) • Single-Core PowerVR® SGX544 3D GPU • One Video Input Port (VIP) Module – Support for up to Four Multiplexed Input Ports • General-Purpose Memory Controller (GPMC) • Enhanced Direct Memory Access (EDMA)Controller • 2-Port Gigabit Ethernet (GMAC) – Up to Two External Ports • Sixteen 32-Bit General-Purpose Timers • 32-Bit MPU Watchdog Timer • Six High-Speed Inter-Integrated Circuit (I2C) Ports • HDQ™/1-Wire® Interface • Ten Configurable UART/IrDA/CIR Modules • Four Multichannel Serial Peripheral Interfaces(McSPI) • Quad SPI Interface (QSPI) • Media Local Bus Subsystem (MLBSS) • Eight Multichannel Audio Serial Port (McASP)Modules • SuperSpeed USB 3.0 Dual-Role Device • High-Speed USB 2.0 Dual-Role Device • High-Speed USB 2.0 On-The-Go • Four MultiMedia Card/Secure Digital/Secure DigitalInput Output Interfaces (MMC/SD/SDIO) • PCI Express® 3.0 Subsystems With Two 5-GbpsLanes – One 2-lane Gen2-Compliant Port – or Two 1-lane Gen2-Compliant Ports • Dual Controller Area Network (DCAN) Modules – CAN 2.0B Protocol • MIPI® CSI-2 Camera Serial Interface • Up to 186 General-Purpose I/O (GPIO) Pins • Power, Reset, and Clock Management • On-Chip Debug With CTools Technology • 28-nm CMOS Technology • 17 mm × 17 mm, 0.65-mm Pitch, 538-Pin BGA(CBD) DRA710应用: • Human-Machine Interface (HMI) • Navigation • Digital and Analog Radio • Multimedia Playback • Automotive Display Audio Systems • Automotive Entry Navigation and MultimediaSystems • Automotive Digital Cluster Systems 图1.DRA710框图 带以太网和CAN汽车网关参考设计TIDA-01425 The TIDA-01425 is a subsystem reference design for automotive gateways focused on increasing bandwidth and processing power in gateway applications. The design implements Ethernet physical layer transceivers (PHYs) for increased bandwidth along with an automotive processor for greater processing capabilities allowing automotive gateways to pass more data at higher speeds. Furthermore, the design offers a starting point for a full automotive gateway design with a full power tree, CAN PHYs, and components selected with automotive requirements and emission specifications in mind to simplify the design process. The TIDA-01425 is a reference design for automotive gateways focused on increasing bandwidth andprocessing power in gateway applications. The design implements Ethernet PHYs for increased bandwidthalong with an automotive processor for greater processing capabilities. Furthermore, the design offers anexcellent starting point for a full automotive gateway design. All components were selected based onautomotive requirements and emission specifications in mind. The TIDA-01425 implements four total PHYs: two ethernet PHYs and two controller area network (CAN) PHYs. A 100BASE-T1 PHY allows forEthernet communication over a single twisted-pair cable, which lowers the wiring weight within the vehiclewhile also boosting overall bandwidth (100 Mb/s). Along with the single 100BASE-T1 PHY, a 100BASE-TXPHY is utilized to allow for diagnostic readings from the various electronic systems of a vehicle. In additionto the Ethernet PHYs, two CAN PHYs allow for communication to CAN buses within the automobile. Finally, the automotive processor allows for faster processing speeds to keep up with the increasedbandwidth and also offers software scalability. Furthermore, through software, the processor can improveoverall vehicle security. 参考设计TIDA-01425主要特性: Processor based system 100BASE-T1 automotive ethernet 100BASE-TX and CAN PHYs Operates off automotive battery Designed to operate through cold crank, jump start, and load dump Reduced EMI power stages Reverse battery protection 参考设计TIDA-01425应用: Applications Processor Module Automotive Gateway Control Units for Construction Equipment Free Space Sensor Motor Control for Rail Transport Vehicle Occupant Detection Sensor 图2.参考设计TIDA-01425外形图 参考设计TIDA-01425主要系统指标: 图3.参考设计TIDA-01425框图 图4.参考设计TIDA-01425电路图(1) 图5.参考设计TIDA-01425电路图(2) 图6.参考设计TIDA-01425电路图(3) 图7.参考设计TIDA-01425电路图(4) 图8.参考设计TIDA-01425电路图(5) 图9.参考设计TIDA-01425电路图(6) 图10.参考设计TIDA-01425电路图(7) 图11.参考设计TIDA-01425电路图(8) 图12.参考设计TIDA-01425电路图(9) 图13.参考设计TIDA-01425电路图(10) 图14.参考设计TIDA-01425电路图(11) 参考设计TIDA-01425材料清单: 图15.参考设计TIDA-01425 PCB设计图(1) 图16.参考设计TIDA-01425 PCB设计图(2) 图17.参考设计TIDA-01425 PCB设计图(3) 图18.参考设计TIDA-01425 PCB设计图(4) 图19.参考设计TIDA-01425 PCB设计图(5) 图20.参考设计TIDA-01425 PCB设计图(6) 图21.参考设计TIDA-01425 PCB设计图(7) 图22.参考设计TIDA-01425 PCB设计图(8) 图23.参考设计TIDA-01425 PCB设计图(9) 图24.参考设计TIDA-01425 PCB设计图(10) 图25.参考设计TIDA-01425 PCB设计图(11) 图26.参考设计TIDA-01425 PCB设计图(12)  

    时间:2020-07-25 关键词: TI 以太网

  • TI TPS92830-Q1三路大电流线性LED控制方案

    TI TPS92830-Q1三路大电流线性LED控制方案

    TI公司的TPS92830-Q1是三路大电流线性LED控制器,器件集成了两级用于低压降工作的电荷泵.满足AEC-Q100规范,工作温度–40℃ 到125℃,输入电压从4.5V到40V, 20:1模拟调光,通过PWM输入和电源进行PWM调光,主要用在汽车前照明如位置灯,白天运营灯,前转向灯,近光灯以及汽车后照明如尾灯和停车灯,后转向灯,雾灯和倒车灯.本文介绍了TPS92830-Q1主要特性,框图和典型应用电路,以及评估板TPS92830-Q1 EVM主要特性,电路图和LED板电路图,以及材料清单和PCB设计图. With the trend of better lighTIng homogeneity, highcurrentLEDs are often used in automoTIve front andrear lamps with lighTIng diffusers and light-guides.Meanwhile, in order to meet strict EMC and reliabilityrequirements, linear LED drivers are popular inautomotive applications. However, it is a challenge todeliver high current for linear LED drivers withintegrated power transistors. The TPS92830-Q1device is an advanced automotive-grade high-sideconstant-current linear LED controller for delivering high current using external N-channel MOSFETs. Thedevice has a full set of features for automotiveapplications and is compatible with a wide selectionof N-channel MOSFETs. Each channel of the TPS92830-Q1 device sets thechannel current independently by the sense-resistorvalue. An internal precision constant-currentregulation loop senses the channel current by thevoltage across the sense resistor and controls thegate voltage of the N-channel MOSFET accordingly. The device also integrates a two-stage charge pumpfor low-dropout operation. The charge-pump voltageis high enough to support a wide selection of NchanneliMOSFETs. iPWMidimmingiallowsimultiplesources for flexibility—internal PWM generator, external PWM inputs, or power supply dimming. Variousdiagnostics and protection features specially designed for automotive applications help improve systemrobustness and ease of use. A one-fails–all-fail fault bus supports TPS92830-Q1 operation together with the TPS92630-Q1, TPS92638-Q1, and TPS9261x-Q1 family to fulfill various fault-handling requirements. TPS92830-Q1主要特性: 1• AEC-Q100 Qualified – Device Temperature Grade 1:–40℃ to 125℃ Ambient Operating Temperature Range – Device HBM ESD Classification Level H2 – Device CDM ESD Classification Level C4B • Wide Voltage Input Range From 4.5 V to 40 V • 3-Channel High-Side Current Driving and Sensing – Channel-Independent Current Setting – Channel-Independent PWM Inputs – PWM Dimming via Both PWM Inputs andPower Supply – Optimized Slew Rate for EMC • High-Precision LED Driving – Precision Current Regulation With External NChannelMOSFET (2.5% Tolerance) – 20:1 Analog Dimming Profile With Off-BoardBin Resistor Support – Precision PWM Generator With Full Duty-Cycle Mask (2% Tolerance) – Open-Drain PWM Output for Synchronization • Protection and Diagnostics – Adjustable Output Current Derating forExternal MOSFET Thermal Protection – Diagnostics for LED-String Open Circuit orShort Circuit With Auto Recovery – Diagnostic-Enable With Adjustable Thresholdfor Low-Voltage Operation – Fault Bus up to 15 Devices, Configurable AsEither One-Fails–All-Fail or Only-Failed-Channel-Off – Low Quiescent Current in Fault Mode (<0.75mA per Device) • Operating Junction Temperature Range: –40℃ to150℃ • TSSOP 28 Package (PW) TPS92830-Q1应用: • Rear Light – Tail and Stop Light, Rear TurnIndicator, Fog Light, Reverse Light • Front Light – Position Light, Daytime RunningLight, Front Turn Indicator, Low Beam 图1.TPS92830-Q1功能框图 图2.TPS92830-Q1汽车外部照明应用电路图 图3.TPS92830-Q1 PWM发生器主从配置图 评估板TPS92830-Q1 EVM The TPS92830-Q1 evaluation module (EVM) helps designers evaluate the operation and performance of the TPS92830-Q1 device, a linear LED controller with external N-channel MOSFETs for automotive lighting applications. 评估板TPS92830-Q1 EVM主要特性: • Channel-Current Setting by Separate High-Side Sensing Resistors • LED-Short and -Open Protection and Fault Reporting • Auto-Recovery After Removing Fault State • One-Fails–All-Fail With Fault Floating or Only-Failed-Channel-Off LED Failure Mode With Fault PulledUp • Stand-Alone Operation With Full Duty Cycle or PWM Dimming via TPS92830-Q1 Internal PWMGenerator (Useful for Stop or Tail Light and Daytime Running Light (DRL) or Position LightApplications) • PWM Duty Cycle and Frequency Configurable via Jumper • PWM Output Optional for Sync Dimming (PWMOUT Must Be Pulled Up to 5 V Through a Resistor) • Analog Dimming With Potentiometer on LED Board (Can Be Used for Bin Resistor) • Optional LED Board Thermal Protection via ICTRL • Current Derating During Overvoltage • Open-Fault Detection Mask During Dropout Mode • Compatible With Different Type N-Channel MOSFETs 评估板TPS92830-Q1 EVM应用: Automotive DRL, position light, stop or tail light, turn indicator, reverse light, fog light, and so forth 图4.评估板TPS92830-Q1 EVM外形图 图5. LED板外形图 图6.评估板TPS92830-Q1 EVM电路图 图7.LED板电路图 评估板TPS92830-Q1 EVM材料清单: LED板材料清单: 图8.评估板TPS92830-Q1 EVM PCB布局图 图9. LED板PCB布局图

    时间:2020-07-24 关键词: TI LED tps92830

  • TI TIDA-01179 30W汽车前端电源参考设计

    TI TIDA-01179 30W汽车前端电源参考设计

    TI公司的TIDA-01179是30W汽车前端电源参考设计,包括了两个DC/DC转换器:第一个为降压-升压DC/DC转换器,满足ISO 7637-2和ISO16750-2标准;第二个是低成本紧凑的降压转换器,输出高达20W.系统还包括反向电池保护,电瞬变保护和EMI滤波器.参考设计能处理所有的电池所有情况,输入电压3- 36V DC,主要用在HEV/EV牵引逆变器,电子控制单元,电池前端电源和干式双离合器变速器.本文介绍了参考设计TIDA-01179主要特性,框图,HEV/EV牵引逆变器系统框图以及参考设计TIDA-01179电路图,材料清单和PCB设计图. This reference design is an automotive front-endpower supply that able to supply a 30-W maximumoutput for the 12-V car battery. The first stage is abuck-boost DC/DC converter, which maintains a stableoutput voltage over the full DC range of the 12-Vbattery conditions specified in ISO 7637-2 and ISO16750-2 standards. Then a low-cost, compact buckconverter is connected to the buck-boost converterand enables up to a 20-W output. The system consistsof reverse battery protection, electrical transientprotections, and EMI filters. The EMI filter consists ofDM and CM respectively and is designed forcomplying conducted EMI standards per CISPR25. This reference design is a wide input 30-W front-end power supply for a 12-V car battery in the HEV/EVtraction inverter system. It consists of two DC/DC converters. The first converter is a buckboostconverter, which handles a wide input range from the car battery and provides 15 V of constantoutput voltage at a 2-A output current. This 15-V rail can be used to power the system basis chip (SBC),the resolver, and the primary of the IGBT bias supply. Then a buck converter connected to the output ofbuck-boost converts the 15 V down to 5 V at 4.5 A. This 5 V can power the microcontrollers, ADconverters, safety diagnostic circuits, the primary sides of the current sensing, voltage sensing, and so on. The TIDA-01179 is able to handle all battery conditions, which includes: • The system maintains a constant output voltage over the full DC range of battery conditions specifiedin ISO 16750-2: – Input VIN(min) down to 3.0 V simulating a severe cold cranking condition – Input VIN(max) up to 28 V simulating the upper range of normal battery operation • The system must clamp and filter high-voltage electrical fast transients and maintain operation throughthem: – These pulses include clamped load dump (up to 38 V) and other transients outlined in ISO 7637-2:2004. • The system must properly respond to a reverse battery polarity event and shut down appropriately. • Filter design targets at the CISPR 25 automotive EMI standard for conducted emission suppression. • The layout of the board must be done in such a way to minimize the footprint of the solution whilemaintaining high performance. 参考设计TIDA-01179主要特性: • Wide-VIN Buck-Boost Converter During Very LowDips in Input Voltage of 3- to 36-V DC, 42-VTransient • Low-Cost Buck Operates After the Buck-Boost With5-V and 4.5-A maximum output • Reverse Battery Protection With Fast Shutdown • Designed and Tested for Severe Battery ColdCrank Operations (ISO 16750-2 Level III) • Designed and Tested for ISO 7637-2:2004 Pulse 1,2a, and 3a/b Severe Conditions (Level IV) • Tested for CISPR25 Conducted EMI (Class 5) 参考设计TIDA-01179应用: • HEV/EV Traction Inverter • Dry Double Clutch Transmission • Electronic Control Units • Battery Front-End Power 图1.参考设计TIDA-01179外形图 图2.参考设计TIDA-01179框图 图3.HEV/EV牵引逆变器系统框图和TIDA-01179的位置 图4.参考设计TIDA-01179电路图(1) 图5.参考设计TIDA-01179电路图(2) 图6.参考设计TIDA-01179电路图(3) 参考设计TIDA-01179材料清单: 图7.参考设计TIDA-01179 PCB设计图(1) 图8.参考设计TIDA-01179 PCB设计图(2) 图9.参考设计TIDA-01179 PCB设计图(3) 图10.参考设计TIDA-01179 PCB设计图(4) 图11.参考设计TIDA-01179 PCB设计图(5) 图12.参考设计TIDA-01179 PCB设计图(6) 图13.参考设计TIDA-01179 PCB设计图(7) 图14.参考设计TIDA-01179 PCB设计图(8) 图15.参考设计TIDA-01179 PCB设计图(9) 图16.参考设计TIDA-01179 PCB设计图(10)

    时间:2020-07-21 关键词: TI 逆变器

  • TMS570LS0432主要特性及电动汽车电池管理系统

    TMS570LS0432主要特性及电动汽车电池管理系统

    TI公司的TMS570LS0432/0332是高性能汽车级的16位和32位RISC闪存微控制器,集成了ARM Cortex-R4 CPU,提供1.66 DMIPS/MHz,工作频率高80MHz,性能高达132DMIPS;其安全的架构包括步调一致的两个CPU,CPU和存储器内部自检(BIST)逻辑,闪存和数据SRAM的ECC,外设存储器奇偶校验以及I/O的回送功能,主要用在刷车系统(ABS和ESC),主动辅助驾驶系统,EPS,航空航天,电泵控制,铁路通信,电池管理系统和越野汽车。本文介绍了TMS570LS0432主要特性,功能框图,以及电动汽车电池管理系统(BMS)TIDM-TMS570BMS参考设计主要特性,框图,电路图和材料清单。 The TMS570LS0432/0332 device is a high-performance automoTIve-grade microcontroller for safetysystems. The safety architecture includes dual CPUs in lockstep, CPU and Memory BIST logic, ECC onboth the flash and the data SRAM, parity on peripheral memories, and loopback capability on peripheralI/Os. The TMS570LS0432/0332 device integrates the ARM Cortex-R4 CPU. The CPU offers an efficient1.66 DMIPS/MHz, and has configuraTIons that can run up to 80 MHz, providing up to 132 DMIPS. Thedevice supports the big-endian (BE32) format. The TMS570LS0432/0332 device has 384KB and 256KB of integrated flash (respectively) and 32KB ofdata RAM. Both the flash and RAM have single-bit error correction and double-bit error detection. Theflash memory on this device is a nonvolatile, electrically erasable, and programmable memoryimplemented with a 64-bit-wide data bus interface. The flash operates on a 3.3-V supply input (the samelevel as I/O supply) for all read, program, and erase operations. When in pipeline mode, the flash operateswith a system clock frequency of 80 MHz. The SRAM supports single-cycle read and write accesses in byte, halfword, word, and double-word modes throughout the supported frequency range. The TMS570LS0432/0332 device features peripherals for real-time control-based applications, including aNext Generation High-End Timer (N2HET) timing coprocessor with up to 19 I/O terminals and a 12-bitAnalog-to-Digital Converter (ADC) supporting 16 inputs in the 100-pin package. The N2HET is an advanced intelligent timer that provides sophisticated timing functions for real-timeapplications. The timer is software-controlled, using a small instruction set, with a specialized timermicromachine and an attached I/O port. The N2HET can be used for pulse-width-modulated outputs,capture or compare inputs, or GPIO. The N2HET is especially well suited for applications requiringmultiple sensor information and drive actuators with complex and accurate time pulses. A High-End TimerTransfer Unit (HTU) can perform DMA-type transactions to transfer N2HET data to or from main memory.A Memory Protection Unit (MPU) is built into the HTU. The Enhanced Quadrature Encoder Pulse (eQEP) module is used for direct interface with a linear orrotary incremental encoder to get position, direction, and speed information from a rotating machine asused in high-performance motion and position-control systems. The device has a 12-bit-resolution MibADC with 16 channels and 64 words of parity-protected buffer RAM.The MibADC channels can be converted individually or can be grouped by software for sequentialconversion sequences. There are three separate groupings. Each sequence can be converted once whentriggered or configured for continuous conversion mode. The MibADC has a 10-bit mode for use whencompatibility with older devices or faster conversion time is desired. The device has multiple communication interfaces: one MibSPI, two SPIs, one UART/LIN, and twoDCANs. The SPI provides a convenient method of serial high-speed communications between similarshift-register type devices. The UART/LIN supports the Local Interconnect standard 2.1 and can be usedas a UART in full-duplex mode using the standard Non-Return-to-Zero (NRZ) format. The DCAN supportsthe CAN 2.0 (A and B) protocol standard and uses a serial,multimaster communication protocol thatefficiently supports distributed real-time control with robust communication rates of up to 1 Mbps. TheDCAN is ideal for applications operating in noisy and harsh environments (for example,automotive andindustrial applications) that require reliable serial communication or multiplexed wiring. The Frequency-Modulated Phase-Locked Loop (FMPLL) clock module is used to multiply the externalfrequency reference to a higher frequency for internal use. The FMPLL provides one of the five possibleclock source inputs to the Global Clock Module (GCM)。 The GCM manages the mapping between theavailable clock sources and the device clock domains. The device also has an External Clock Prescaler (ECP) module that when enabled, outputs a continuousexternal clock on the ECLK pin. The ECLK frequency is a user-programmable ratio of the peripheralinterface clock (VCLK) frequency.This low-frequency output can be monitored externally as an indicator ofthe device operating frequency. The Error Signaling Module(ESM) monitors all device errors and determines whether an interrupt is generated or the external nERROR pin is toggled when a fault is detected. The nERROR pin can bemonitored externally as an indicator of a fault condition in the microcontroller.The I/O Multiplexing and Control Module (IOMM) allows the configuration of the input/output pins tosupport alternate functions. With integrated safety features and a wide choice of communication and control peripherals, theTMS570LS0432/0332 device is an ideal solution for real-time control applications with safety-criticalrequirements. TMS570LS0432主要特性: TMS570LS0432主要应用: • Braking Systems (ABS and ESC) • Active Driver Assistance Systems • Electric Power Steering (EPS) • Aerospace and Avionics • Electric Pump Control • Railway Communications • Battery-Management Systems • Off-road Vehicles 图1.TMS570LS0432功能框图 电动汽车电池管理系统(BMS)TIDM-TMS570BMS参考设计 TMS570 Active Cell-Balancing Battery-Management Design Guide This battery-management system (BMS) example illustrates a TMS570LS0432 (an ISO 26262 capable)MCU supporting active cell balancing between one cell in a 16-cell battery module and a 12-V supply.Self-diagnostic functions are enabled to monitor the status of TMS570LS0432 during run time.TMS570LS0432 configures BQ76PL455A-Q1 to monitor battery cell status through a UART port. TMS570LS0432 analyzes the cell data and generates a balancing command. The real-time interrupt (RTI)timer is configured to schedule active balancing functions. The balancing command is passed through theserial peripheral interface (SPI) to EMB1428Q and EMB1499Q to enable charge or discharge of the cellselected. The user can view the cell voltage and other status data and control the system operation usinga graphical user interface (GUI) running on the host PC. TMS570LS0432 communicates with the host PC through a UART port emulated by the N2HET module. The software accompanying this design is developed and tested on a TMS570LS0432 LaunchPad™(LAUNCHXL-TMS57004) and an EM1402 EVM. Plug-in Hybrid Electric Vehicles (PHEV) and Battery Electric Vehicles (BEV) are two quickly emerging technologies which use powerful electric motors as the propulsion source. In order to power these electric motors, large battery packs made up of hundreds of cells totaling 300-400 volts are installed in the vehicle. Since batteries have a finite energy capacity, PHEV and BEV must be recharged on a periodic basis, typically by connecting to the power grid. The charging system for these vehicles consists of a an AC/DC rectifier to generate a DC voltage from the AC line followed by a DC/DC converter to generate the DC voltage required by the battery pack. Additionally, advanced charging systems might also communicate with the power grid using PLC modems to adjust charging based on power grid conditions. The battery pack must also be carefully monitored during operation and the charging process in order to maximize energy usage and prolong battery life.High-performance analog parts are also available to provide critical system functions and features such as sensor feedback, isolation, chip power supplies, and communication transceivers. The bq7xPLxxx device families are designed for high cell count battery packs. They can handle the voltages and currents found in higher power applications like power tools and electronic mobility. The more cells a pack has in series, the greater the difference in state of charge, impedance and capacitance affect the health and energy deliver of the pack. The bq7xPLxxx devices include circuitry for bringing the cells back into balance. This increases lifetime of the pack and can help deliver as much energy to the application as possible. Each bq7xPLxxx device protects from over charge, over discharge, over temperature and high current events for pack and system safety. A system example for an active cell balancing battery management system. The TMS570LS0432 microcontroller commands EMB1402 EVM to monitor the battery cells and perform charge/discharge from one battery cell to an external 12V supply. The user can view the cell status and control cell balancing from a GUI running on the host PC. 电池管理系统(BMS)参考设计TIDM-TMS570BMS主要特性: 设计特性: • The Diagnostic Features of TMS570LS0432microcontroller (MCU) Are Enabled to Monitor andReport TMS570LS0432 Status During Run Time. • The TMS570LS0432 MCU ConfiguresBQ76PL455A-Q1 for Monitoring Cell Voltages andChecking BQ76PL455A-Q1 Status During RunTime. • The TMS570LS0432 MCU Analyzes the Data FromAll Cells and Generates Active Cell BalancingCommands. • The TMS570LS0432 MCU Commands EMB1428Qfor Cell Balancing and Monitors EMB1428Q andEMB1499Q Status During Run Time. • The TMS570LS0432 MCU Communicates WithHost PC Through a Universal AsynchronousReceiver and Transmitter (UART) Emulated by theNext Generation High-End Timer (N2HET) Moduleto Display the Status and Control the BalancingOperation During Run Time. 主要应用: • Electric and Hybrid Electric Vehicles (EVs, HEVs,PHEVs, and mild hybrids) • Energy Storage Systems (ESS) • Uninterruptible Power Supplies (UPSs) • E-Bikes and E-Scooters 图2.电池管理系统(BMS)参考设计TIDM-TMS570BMS外形图 图3.参考设计TIDM-TMS570BMS框图(1) 图4.参考设计TIDM-TMS570BMS框图(2) 图5.参考设计TIDM-TMS570BMSLaunchPad电路图(1) 图6.参考设计TIDM-TMS570BMSLaunchPad电路图(2) 图7.参考设计TIDM-TMS570BMSLaunchPad电路图(3) 图8.参考设计TIDM-TMS570BMSLaunchPad电路图(4) 图9.参考设计TIDM-TMS570BMSLaunchPad电路图(5) 图10.参考设计TIDM-TMS570BMSLaunchPad电路图(6) 图11.参考设计TIDM-TMS570BMSEM1402 EVM电路图(1) 图12.参考设计TIDM-TMS570BMSEM1402 EVM电路图(2) 图13.参考设计TIDM-TMS570BMSEM1402 EVM电路图(3) 图14.参考设计TIDM-TMS570BMSEM1402 EVM电路图(4) 图15.参考设计TIDM-TMS570BMSEM1402 EVM电路图(5) 图16.参考设计TIDM-TMS570BMSEM1402 EVM电路图(6) 图17.参考设计TIDM-TMS570BMSEM1402 EVM电路图(7) 图18.参考设计TIDM-TMS570BMSEM1402 EVM电路图(8) 图19.参考设计TIDM-TMS570BMSEM1402 EVM电路图(9) 图20.参考设计TIDM-TMS570BMSEM1402 EVM电路图(10) LaunchPad™(LAUNCHXL-TMS57004) and an EM1402 EVM TMS570LS0432 Launchpad材料清单(BOM): EM1402 EVM材料清单(BOM):

    时间:2020-07-20 关键词: TI 闪存微控制器 tms570ls0432

  • bq76PL536A-Q1主要特性及锂电池监视和保护参考设计

    bq76PL536A-Q1主要特性及锂电池监视和保护参考设计

    TI公司的bq76PL536A-Q1是可堆栈的三--六颗锂电池组保护器和模拟前端(AFE),集成了精密的ADC,单独的电池电压和温度保护,电池平衡和给用户电路供电的精密V稳压器.电源电压从7.2 V 到 27 V,主要用在电动和混合动力汽车,电动自行车和电动滑板车,不间断电源(UPS)和大型电池系统.本文介绍了bq76PL536A-Q1主要特性,框图和简化的系统连接图以及锂电池监视和保护参考设计TIDA-00821主要特性,框图,电路图,材料清单和PCB设计图.   The bq76PL536A-Q1 is a stackable three to six series cell lithium-ion battery pack protector and analog front end (AFE) that incorporates a precision analog-to-digital converter (ADC); independent cell voltage and temperature protecTIon; cell balancing, and a precision 5-V regulator to power user circuitry.   The bq76PL536A-Q1 integrates a voltage translaTIon and precision analog-to-digital converter system to measure battery cell voltages with high accuracy and speed.   The bq76PL536A-Q1 provides full protection (secondary protection) for overvoltage, undervoltage, and overtemperature conditions. When safety thresholds are exceeded, the bq76PL536A-Q1 sets the FAULT output. No external components are needed to configure or enable the protection features.   Cell voltage and temperature protection functions are independent of the ADC system. Programmable protection thresholds and detection delay times are stored in Error Check/Correct (ECC) OTP EPROM, which increases the flexibility and reliability of the battery management system.   The bq76PL536A-Q1 is intended to be used with a host controller to maximize the functionality of the battery management system. However, the protection functions do not require a host controller.   The bq76PL536A-Q1 can be stacked vertically to monitor up to 192 cells without additional isolation components between ICs. A high-speed serial peripheral interface (SPI) bus operates between each bq76PL536A-Q1 to provide reliable communications through a high-voltage battery cell stack.   bq76PL536A-Q1主要特性:   • Three-to-six series cell support, all chemistries   • Hot-pluggable   • High-speed serial peripheral interface (SPI) for data communications   • Stackable vertical interface   • Isolation components not required between devices   • Qualified for automotive applications   • AEC-Q100 qualified with the following results:   – Device temperature grade 2: –40℃ to 105℃ ambient operating temperature range   – Device HBM classification level 2   – Device CDM classification level C4B   • High-accuracy ADC:   – ±1-mV typical accuracy   – 14-bit resolution, 6-μs conversion time   – Nine ADC inputs   – Dedicated pins for synchronizing measurements   • Configuration data stored in error check/correct(ECC)one-time-programmable (OTP)registers   • Built-in comparators (secondary protector) for:   – Overvoltage and undervoltage protection   – Overtemperature protection   – Programmable thresholds and delay times   – Dedicated fault signals   • Cell balancing control outputs with safety timeout   – Balance current set by external components   • Supply voltage range from 7.2 V to 27 V continuous and 36-V peak   • Low power:   – Typical 12-μA sleep, 45-μA idle   • Integrated precision 5-V,3-mA LDO   bq76PL536A-Q1应用:   Electric and Hybrid Electric Vehicles   E-Bike and E-Scooter   Uninterruptible Power Systems (UPS)   Large-Format Battery Systems   bq76PL536A-Q1终端设备:   EV HEV Battery Management System   HEV/EV - Battery Management System (BMS) 图1.bq76PL536A-Q1框图   图2.bq76PL536A-Q1简化的系统连接图   bq76PL536A-Q1参考设计TIDA-00821   The TIDA-00821 reference design is a stackable monitor and protector for use in large format Lithium-ion batteries that provides monitoring, balancing, and communications. Each bq76PL536A-Q1 EVM can manage 3 to 6 cells for Li-ion battery applications. Up to 32 bq76PL536A-Q1 EVM modules can be stacked. The system provides fast cell balancing, diagnostics, and module to controller communication. Independent protection circuitry isalso integrated.   参考设计TIDA-00821主要特性:   Highly accurate monitoring and protection   Engineered for high system robustness   1-Mb/s stackable vertical interface   Built in comparator for secondary OV, UV and OT protector   Cell balancing control output with safety timeout 图3.参考设计TIDA-00821外形图 图4. bq76PL536A-Q1 EVM-3测试建立图 图5.参考设计TIDA-00821框图 图6.参考设计TIDA-00821电路图(1) 图7.参考设计TIDA-00821电路图(2) 图8.参考设计TIDA-00821电路图(3) 图9.参考设计TIDA-00821电路图(4) 参考设计TIDA-00821材料清单(BOM):   图10.参考设计TIDA-00821 PCB设计图(1) 图11.参考设计TIDA-00821 PCB设计图(2) 图12.参考设计TIDA-00821 PCB设计图(3) 图13.参考设计TIDA-00821 PCB设计图(4) 图14.参考设计TIDA-00821 PCB设计图(5) 图15.参考设计TIDA-00821 PCB设计图(6) 图16.参考设计TIDA-00821 PCB设计图(7) 图17.参考设计TIDA-00821 PCB设计图(8)

    时间:2020-07-20 关键词: TI 锂电池 adc

  • 全球ic厂商排名 TI领衔恩智浦负增长

    全球ic厂商排名 TI领衔恩智浦负增长

    【导读】:中美贸易战让半导体成为了敏感词,我国半导体严重依赖进口,这是短期内无法改变的现状,拥有半导体核心技术的厂商过去的一年在市场的表现如何呢? 去年,十大供应商占据了59%的模拟市场,德州仪器(TI)扩大在顶级模拟供应商中的领先地位,ON Semiconductor的增长最为强劲。 IC Insights的2018年McClean报告最近一次月度更新显示,去年在545亿美元模拟市场中排名前10的IC供应商占该类别2017年全球销售额的59%。综合来看,前10家公司去年的模拟IC销售额为323亿美元,而2016年的销售额为284亿美元,同比增长14%,市场份额增长2个百分点。根据最新消息,前十家供应商中有八家的2017年总体模拟市场增长率超过10%。 凭借模拟销售额达99亿美元和18%的市场份额,德州仪器在2017年再次成为模拟集成电路的领先供应商。2016年,TI的模拟IC市场份额为17%。去年,该公司的模拟销售额增长了约14亿美元,增长了16%,是排名第二的ADI公司的两倍多。根据IC Insights的估计,TI 2017年模拟收入占其130亿美元IC总销售额的76%,以及其139亿美元半导体总收入的71%。 TI是首批在300毫米晶圆上生产模拟半导体的公司之一。 TI声称,与使用200毫米晶圆相比,在300毫米晶圆上制造模拟集成电路使每个未封装芯片的成本优势达到40%。在2017年,TI模拟收入的一半以上使用300毫米晶圆制造。 根据IC Insights的供应商排名,第二名的ADI公司2017年的模拟IC销售额增长14%,达到43亿美元。针对ADI展示的2016年和2017年收入数据包括凌特公司的销售额,该公司于2017年第一季度以158亿美元收购了凌力尔特公司。 恩智浦(NXP)是去年排名前10位的唯一负增长的供应商,其去年的模拟销售额下降了(-1%)。恩智浦的模拟收入下滑部分可归因于其标准产品业务出售给由建广资本和Wise Road Capital组成的中国投资者联盟。这笔27.5亿美元的交易于2017年2月完成。标准产品业务更名为Nexperia,总部位于荷兰。 在前10名中,安森美半导体2017年的模拟销售额增幅最大,收入增长35%至18亿美元,占市场份额的3%。 2016年其模拟销售额增长16%。过去两年销售额的强劲增长是ON Semi于2016年9月以24亿美元收购飞兆半导体公司的结果。 ON的模拟业务在2017年也因其电源管理产品在汽车市场的销售额创纪录地增长,尤其是主动安全,动力总成,车身电子和照明应用。

    时间:2020-07-18 关键词: TI 恩智浦 安森美

  • TI DRA71x汽车信息娱乐系统参考设计TIDEP-0097

    TI DRA71x汽车信息娱乐系统参考设计TIDEP-0097

    TI公司的DRA71x系列是600 MHz ARM Cortex-A15 SoC处理器,其架构提供汽车应用时的高性能并行处理特性,包括图像,语音,HMI,多媒体和智能手机投影模式功能,采用28-nm CMOS技术,支持全高清(HD)视频(1920&TImes;1080p, 60 fps),多视频输入和视频输出以及2D和3D图像,主要用在人机接口(HMI),导航,数字和模拟无线电,多媒体播放器,汽车显示音频系统,入门级导航和多媒体系统以及汽车数字仪表盘系统.本文介绍了DRA71x系列主要特性,框图以及汽车信息娱乐系统参考设计TIDEP-0097主要特性和系统指标,框图,电路图和材料清单. The DRA71x processor is offered in a 538-ball, 17&TImes;17-mm, 0.65-mm ball pitch (0.8mm spacing rules canbe used on signals) with Via Channel™ Array (VCA) technology, ball grid array (BGA) package. The architecture is designed to deliver high-performance concurrencies for automotive applications in acost-effective solution, providing full scalability from the DRA75x (“Jacinto 6 EP ” and “ Jacinto 6 Ex”),DRA74x “Jacinto 6” and DRA72x “Jacinto 6 Eco” family of infotainment processors, including graphics,voice, HMI, multimedia and smartphone projection mode capabilities. Programmability is provided by a single-core ARM Cortex-A15 RISC CPU with Neon™ extensions and aTI C66x VLIW floating-point DSP core. The ARM processor lets developers keep control functionsseparate from other algorithms programmed on the DSP and coprocessors, thus reducing the complexityof the system software. Additionally, TI provides a complete set of development tools for the ARM, and DSP, including C compilers and a debugging interface for visibility into source code execution.The DRA71x Jacinto 6 Entry processor family is qualified according to the AEC-Q100 standard. The device features a simplified power supply rail mapping which enables lower cost PMIC solutions. DRA71x系列主要特性: • Architecture Designed for InfotainmentApplications • Video, Image, and Graphics Processing Support – Full-HD Video (1920 × 1080p, 60 fps) – Multiple Video Input and Video Output – 2D and 3D Graphics • ARM® Cortex®-A15 Microprocessor Subsystem • C66x Floating-Point VLIW DSP – Fully Object-Code Compatible With C67x andC64x+ – Up to Thirty-two 16 × 16-Bit Fixed-PointMultiplies per Cycle • Up to 512KB of On-Chip L3 RAM • Level 3 (L3) and Level 4 (L4) Interconnects • DDR3/DDR3L Memory Interface (EMIF) Module – Supports up to DDR-1333 (667 MHz) – Up to 2GB Across Single Chip Select • Dual ARM® Cortex®-M4 Image Processing Units(IPU) • IVA-HD Subsystem • Display Subsystem – Display Controller With DMA Engine and up toThree Pipelines – HDMI™ Encoder: HDMI 1.4a and DVI 1.0Compliant • 2D-Graphics Accelerator (BB2D) Subsystem – Vivante™ GC320 Core • Video Processing Engine (VPE) • Single-Core PowerVR® SGX544 3D GPU • One Video Input Port (VIP) Module – Support for up to Four Multiplexed Input Ports • General-Purpose Memory Controller (GPMC) • Enhanced Direct Memory Access (EDMA)Controller • 2-Port Gigabit Ethernet (GMAC) – Up to Two External Ports • Sixteen 32-Bit General-Purpose Timers • 32-Bit MPU Watchdog Timer • Six High-Speed Inter-Integrated Circuit (I2C) Ports • HDQ™/1-Wire® Interface • Ten Configurable UART/IrDA/CIR Modules • Four Multichannel Serial Peripheral Interfaces(McSPI) • Quad SPI Interface (QSPI) • Media Local Bus Subsystem (MLBSS) • Eight Multichannel Audio Serial Port (McASP)Modules • SuperSpeed USB 3.0 Dual-Role Device • High-Speed USB 2.0 Dual-Role Device • High-Speed USB 2.0 On-The-Go • Four MultiMedia Card/Secure Digital/Secure DigitalInput Output Interfaces (MMC/SD/SDIO) • PCI Express® 3.0 Subsystems With Two 5-GbpsLanes – One 2-lane Gen2-Compliant Port – or Two 1-lane Gen2-Compliant Ports • Dual Controller Area Network (DCAN) Modules – CAN 2.0B Protocol • MIPI® CSI-2 Camera Serial Interface • Up to 186 General-Purpose I/O (GPIO) Pins • Power, Reset, and Clock Management • On-Chip Debug With CTools Technology • 28-nm CMOS Technology • 17 mm × 17 mm, 0.65-mm Pitch, 538-Pin BGA(CBD) DRA71x系列应用: • Human-Machine Interface (HMI) • Navigation • Digital and Analog Radio • Multimedia Playback • Automotive Display Audio Systems • Automotive Entry Navigation and MultimediaSystems • Automotive Digital Cluster Systems   图1.DRA71x系列框图 汽车信息娱乐系统参考设计TIDEP-0097 This automotive reference design is based on TI’sJacinto™ DRA71x processor and focuses on systemlevel cost savings.The six-layer design reduces PCBcosts through optimized via breakout scheme andpower distribution network as well as integration of keyfeatures. Functionality can be added or removedbased on the end product requirements. This designtargets applications such as infotainment andreconfigurable digital cluster. The design has a 12-Vinput with a single PMIC. The design supports HDMI,USB3.0 or USB2.0, TAS6424 digital Class-D amplifier,FPD-Link interface, and many other features. ALinux®, Android™, or QNX based softwaredevelopment kit (SDK) is included. This reference design is a system that includes the DRA 71x automotive applications processor, a powersolution, DRAM(DDR3L), and multiple interface ports an expansion connectors. This system is designedon a six-layer PCB using a unique via breakout scheme, a single PMIC solution, and fewer but integratedfunctions that allows for lower manufacturing costs without sacrificing quality of the end product. Thereference design targets entry level infotainment applications with a high-end look and feel. An HDMI andFPD-Link III port allows for the connection of a high-definition display and rear view camera to provide arich user interface. A Bluetooth ® and Wi-Fi® module, audio and tuner inputs, and USB port are included toallow for connectivity of wireless and wired audio devices for rich output from the Class-D audio amplifier.The optimized power solution allows the design to be powered from a single 12-V power source. 参考设计TIDEP-0097主要特性: • TI Jacinto DRA71x Processor With IntegratedFeatures Help Design Cost-Effective, Feature Rich,Entry Level (Display Audio) Infotainment andCluster Systems • DRA71x Superset Processor With 2D and 3Dgraphics, C66x DSP, and Cortex®-M4 options • Processor SDK for Linux, Android, and QNXDevelopment With Add-on Packages for Radio andAudio • Cost Saving Features Include Six-Layer HWDesign, Rear View Camera (RVC) Support, TunerIntegration with Software Defined Radio(SDR),Class-D Amplifier and Multi-Sone Audio Support • Includes TI ’ s Solution and Support for Power,Audio, Processing, and Display 参考设计TIDEP-0097应用: • Entry Level In Vehicle Infotainment (IVI) Head Unit • Digital Cluster • Radio and Audio Co-processor • Automotive Amplifier 图2.参考设计TIDEP-0097外形图 参考设计TIDEP-0097主要系统指标: 图3.参考设计TIDEP-0097框图 图4.参考设计TIDEP-0097电路图(1) 图5.参考设计TIDEP-0097电路图(2) 图6.参考设计TIDEP-0097电路图(3) 图7.参考设计TIDEP-0097电路图(4) 图8.参考设计TIDEP-0097电路图(5) 图9.参考设计TIDEP-0097电路图(6) 图10.参考设计TIDEP-0097电路图(7) 图11.参考设计TIDEP-0097电路图(8) 图12.参考设计TIDEP-0097电路图(9) 图13.参考设计TIDEP-0097电路图(10) 图14.参考设计TIDEP-0097电路图(11) 图15.参考设计TIDEP-0097电路图(12) 图16.参考设计TIDEP-0097电路图(13) 图17.参考设计TIDEP-0097电路图(14) 图18.参考设计TIDEP-0097电路图(15) 图19.参考设计TIDEP-0097电路图(16) 图20.参考设计TIDEP-0097电路图(17) 图21.参考设计TIDEP-0097电路图(18) 图22.参考设计TIDEP-0097电路图(19) 图23.参考设计TIDEP-0097电路图(20) 图24.参考设计TIDEP-0097电路图(21) 图25.参考设计TIDEP-0097电路图(22) 图26.参考设计TIDEP-0097电路图(23) 图27.参考设计TIDEP-0097电路图(24) 参考设计TIDEP-0097材料清单:

    时间:2020-07-17 关键词: TI

  • TI OV10640汽车1.3M照相模块TIDA-00421参考设计

    TI OV10640汽车1.3M照相模块TIDA-00421参考设计

    TI公司的汽车1.3M照相模块TIDA-00421参考设计采用图像传感器OV10640和FPD-Link III串行化器DS90UB913A以及降压转换器TPS62170-Q1.支持1280x1080,VGA,QVGA和任何的缩放尺寸,具有高动态范围,高灵敏度和安全特性以及低功耗等特性.主要用在ADAS可视系统,环视系统和后视摄影镜头.本文介绍了OV10640主要特性,框图,以及汽车1.3M照相模块TIDA-00421参考设计主要特性,框图,电路图,材料清单和PCB设计图. The OV10640 is the automoTIve industry’s first image sensor to utilize backside illumination technology, enabling industry-leading sensitivity and high dynamic range (HDR) up to 120 dB in the smallest possible automotive-grade package. The OV10640 is well suited for a broad range of advanced driver assistance systems (ADAS), including: 360-degree surround view, rear view, machine vision, blind spot detection, and lane departure warning. The sensor’s 4.2-micron OmniBSI™ pixel is capable of recording highly detailed full-resolution 1.3-megapixel images and video at 60 frames per second (fps). The sensor uses OmniVision’s unique split pixel HDR technology, in which the scene information is sampled simultaneously rather than sequentially, minimizing motion artifacts and delivering superior image quality in RAW output in the most demanding and difficult lighting conditions. The OV10640 contains a well-defined feature set to fulfill Automotive Safety Integrity Level (ASIL) according to ISO26262. The sensor fits into a compact chip-scale package (CSP), and is expected to complete AEC-Q100 Grade-2 qualifications OV10640主要特性: support for image size: 1280x1080,VGA, QVGA and any cropped size high dynamic range high sensitivity safety features low power consumption image sensor processor functions: - automatic exposure/gain control - lens correction - defective pixel cancelation - HDR combination and tone mapping - automatic black level correctionsupported output formats: RAWhorizontal and vertical sub-samplingserial camera control bus (SCCB)for register programminghigh speed serial data transferwith MIPI CSI-2external frame synchronizationcapability parallel 12-bit DVP output embedded temperature sensor one time programmable (OTP)memory Product Specifications active array size: 1280 x 1080 power supply: - analog: 3.14 ~ 3.47V - digital: 1.425 ~ 1.575V - DOVDD: 1.7 ~ 1.9V - AVDD: 1.7 ~ 1.9V power requirements: - active: 250 mW - standby: 100 μW temperature range: - operating: -40℃ to +105℃ sensor ambient temperature and -40℃ to+125℃ junction temperature output interfaces: 12-bit DVP, MIPI/LVDS CSI-2 output formats: - 20-bit combined RAW - 12-bit compressed combined RAW - separated 12-bit RAW - 2x12-bit compressed RAW - 16-bit log domain combined RAW - 3x12-bit uncompressed RAW lens size: 1/2.56" lens chief ray angle: 9° input clock frequency: 6 ~ 27 MHz maximum image transfer rate: - full resolution: 60 fps scan mode: progressive shutter: rolling shutter dynamic range: 120 dB pixel size: 4.2 μm x 4.2 μm image area: 5410 μm x 4570 μm package dimensions: - aCSP: 7430 μm x 7190 μm 图1.OV10640框图 采用OV10640, DS90UB913A的汽车1.3M照相模块TIDA-00421参考设计 This camera design demonstrates a very small solution size for 1.3 Megapixel automotive cameras. Only a single coax connection is required to provide digital video, power, camera control and diagnostics. Output video format is 10-bit up to 100MHz or 12-bit up to 75MHz. 图2.汽车1.3M照相模块外形图 汽车1.3M照相模块主要特性: Size optimized design fits on a single PCB 20x20 mm Power supply optimized for small size and low noise Diagnostic and Built In Self Test (BIST) Single Rosenberger Fakracoax connector for digital video, power, control and diagnostics 1.3 Mpixel HDR image sensor OV10640 from OmniVision providing 12bit raw image data Includes mounting tab for attachment directly to tripod Power over Coax input can range from 4V to 17V 汽车1.3M照相模块主要应用: • ADAS Vision Systems • Surround View Systems • Rear Camera 图3.汽车1.3M照相模块参考设计框图 图4.汽车1.3M照相模块参考设计电路图:串行化器 图5.汽车1.3M照相模块参考设计电路图:同轴连接和电源 图6.汽车1.3M照相模块参考设计电路图:图像 汽车1.3M照相模块参考设计材料清单:   图7.汽车1.3M照相模块参考设计PCB正面和背面外形图 图8.汽车1.3M照相模块参考设计PCB设计图(1) 图9.汽车1.3M照相模块参考设计PCB设计图(2) 图10.汽车1.3M照相模块参考设计PCB设计图(3) 图11.汽车1.3M照相模块参考设计PCB设计图(4) 图12.汽车1.3M照相模块参考设计PCB设计图(5) 图13.汽车1.3M照相模块参考设计PCB设计图(6) 图14.汽车1.3M照相模块参考设计PCB设计图(7) 图15.汽车1.3M照相模块参考设计PCB设计图(8)

    时间:2020-07-17 关键词: TI 图像传感器

  •  TI TAS5404-Q1 26W汽车四路D类放大器参考设计

    TI TAS5404-Q1 26W汽车四路D类放大器参考设计

    TI公司的TAS5404-Q1是用于汽车音响主机的四路D类音频放器,四路模拟输入,四路BTL输出,每路能从14.4V电源中向4欧姆负载连续提供26W输出或向2欧姆负载连续提供45W输出,THD+N小于1%,75dB PSRR.每路增益为12 dB, 20 dB, 26 dB, 32 dB.本文介绍了TAS5404-Q1主要特性,框图和主要应用电路及其材料清单,汽车四路D类放大器参考设计TIDA-00573主要特性,框图,电路图,材料清单和汽车音响主机框图与主要指标. The TAS5404-Q1 device is a four-channel class-D audio amplifier designed for use in automoTIve head units. The TAS5404-Q1 device provides four channels at 20 W conTInuously into 4 Ω at less than 1% THD+N from a 14.4-Vdc supply when used with the application circuit. The input is configured as an analog single-ended interface. The patented PWM topology of the device provides dramatic improvements in efficiency and audio performance over traditional linear amplifier solutions. The improvement in efficiency and audio performance reduces the power dissipated by the amplifier by a factor of ten under typical music playback conditions. The device incorporates all the required functions required by the OEM application. The built-in load diagnostic functions for detecting and diagnosing disconnected speakers help reduce test time during the manufacturing process. TAS5404-Q1主要特性: TAS5404-Q1 – Single-Ended Input Four-Channel Class-D Power Amplifier Four Analog Inputs, Four BTL Power Outputs Typical Output Power at 10% THD+N 26 W/ChInto 4 Ω at 14.4 V 45 W/ChInto 2 Ω at 14.4 V Channels Can Be Paralleled (PBTL) for High- Current Applications THD+N < 0.02%, 1 kHz, 1 W Into 4 Ω Patented Pop-and-Click-Reduction Technology Soft Muting With Gain Ramp Control Common-Mode Ramping Patented AM Interference Avoidance Patented Cycle-by-Cycle Current Limit 75dB PSRR Four-Address I2C Serial Interface for Device Configuration and Control Channel Gains: 12 dB, 20 dB, 26 dB, 32 dB Load Diagnostic Functions: Output Open and Shorted Load Output-to-Power and Output-to-Ground Shorts Patented Tweeter Detection Protection and Monitoring Functions: Short-Circuit Protection Load-Dump Protection to 50 V Fortuitous Open-Ground and Open-Power Tolerant Patented Output DC Level Detection While Music Playing Overtemperature Protection Overvoltage and Undervoltage Conditions Clip Detection 64-Pin QFP (PHD) Power Package With Heat Slug Up Designed for Automotive EMC Requirements Qualified According to AEC-Q100 ISO9000:2002 TS16949-Certified –40℃ to 105℃ Ambient Temperature Range 图1.TAS5404-Q1框图 图2.TAS5404-Q1典型应用电路图 图2TAS5404-Q1典型应用电路的材料清单: 汽车四路D类放大器参考设计TIDA-00573 The TIDA-00573 reference design provides a Class D based amplifier solution that allows it to be evaluated in the form factor of a typical Class AB amplifier.  The design is optimized to mitigate thermals associated with audio amplifiers and to minimize switching noises associated with Class D amplifiers.  This design is comprised of two parts.  The 1st highlights the audio amplifier module while the 2nd highlights the circuitry needed to incorporate it into a base board.  The pair of boards allows stand-alone performance testing of the design. 汽车四路D类放大器参考设计TIDA-00573主要特性: Able to withstand load-dump conditions Size/Space optimized design CISPR-25 tested EMI Able to withstand Start/Stop operation down to 5.6V 图3.汽车四路D类放大器参考设计TIDA-00573外形图 图4.汽车四路D类放大器参考设计TIDA-00573框图 图5.集成了TIDA-00573的汽车音响主机框图 汽车音响系统主要指标: 图6.子板3D外形图 图7.主板3D外形图 图8.参考设计TIDA-00573电路图(1) 图9.参考设计TIDA-00573电路图(2) 图10.参考设计TIDA-00573电路图(3) 图11.参考设计TIDA-00573电路图(4) 图12.参考设计TIDA-00573电路图(5) 图13.参考设计TIDA-00573电路图(6) 参考设计TIDA-00573材料清单: 详情请见: 和 tas5404-q1.pdf

    时间:2020-07-17 关键词: TI 放大器 主板

  • 德州仪器 (TI) 推出了一款设定了最新音频性能的音频运算放大器OPA1622

    德州仪器 (TI) 推出了一款设定了最新音频性能的音频运算放大器OPA1622

    德州仪器 (TI) 推出了一款设定了最新音频性能的音频运算放大器OPA1622。该款产品是TI Burr-Brown Audio产品线家族中的新成员,也是已被广泛采用的OPA1612的升级产品。全新的OPA1622提供高达150mW的高输出功率,以及在10mW功率下-135dB的极低失真,从而为专业音频设备提供最高性能。OPA1622的小尺寸、低功耗和低失真可为头戴式耳机放大器、智能手机、平板电脑和USB音频数模转换器 (DAC) 等便携式设备提供高保真音频。 OPA1622音频放大器的主要特性和优势: • 将音频质量提高到全新高度:OPA1622音频放大器在向32Ω负载输10mW输出功率时,-总体谐波失真 (THD) 低至-135dB,这一数值比性能最接近的同类产品要好12倍,尤其可帮助设计人员用于头戴式耳机应用。在保持最低THD和噪声 (THD+N) 的同时,它还能在削波出现前提供高达150mW的最大输出功率,从而为专业音频应用提供一个无干扰的信号路径。 • 优化高保真便携式音频设备:每通道仅消耗2.6mA的低静态电流,并且在3mm x 3mm双扁平无引线 (DFN) 封装内提供80mARMS 的高线性输出电流。此外,在频率达到20kHz时,电源抑制比 (PSRR) 可达到-97/-123dB,这可使其能够在无需低压降稳压器 (LDO) 的情况下实现开关电源的低失真,从而在保证音频性能的同时节省电路板空间。 • 独特的引脚分配简化了设计,并提升了失真性能:OPA1622以接地为基准的使能引脚可由低功耗处理器的通用输入/输出 (GPIO) 引脚直接控制,从而免除了对于电平位移电路的需要。它的创新型引脚分配改进了印刷电路板 (PCB) 布局布线,并且在高输出功率时能够实现出色的失真性能。 • 消除了可闻滴答声和爆音:独特的使能电路设计, 能在OPA1622进入或脱离关断模式期间限制输出瞬态。 简化设计的工具与技术支持 针对OPA1622的TINA-TI SPICE宏模型 能够帮助设计人员验证电路板级的信号完整性要求。TI Designs的一款针对电压输出音频DAC的高精度参考设计将于2016年第一季度推出,它的推出将加快基于OPA1622的头戴式耳机放大器设计的上市时间。 德州仪器在线支持社区高精度放大器论坛可提供针对OPA1622的技术支持。在这个论坛里,工程师们可以搜索解决方案、获得相关帮助、并与同行工程师和TI专家们一起分享知识和解决难题。 此外,工程师们可以在TI高精度实验室—运算放大器中加深他们的音频专业知识;这是TI的点播培训系列,其中涵盖了包括低失真设计和噪声在内的多种话题。这些视频利用真实环境中的电路,为设计人员们讲解如何实现总体系统性能目标。 封装 目前OPA1622采用3mm x 3mm DFN封装。 推荐伴随器件 要创建高性能音频信号路径,系统设计人员可将OPA1622与TI的PCM1794A Burr-Brown Audio立体声数模转换器(DAC)组合在一起。其它伴随器件还包括在便携式应用中供电的TI TPS65133和TPS65132分离轨转换器。

    时间:2020-07-17 关键词: TI 音频运算放大器

  • TI平衡车介绍

    TI平衡车介绍

    电动平衡车,又叫体感车、思维车、摄位车等。市场上主要有独轮和双轮两类。其运作原理主要是建立在一种被称为“动态稳定”(Dynamic StabilizaTIon)的基本原理上,利用车体内部的陀螺仪和加速度传感器,来检测车体姿态的变化,并利用伺服控制系统,精确地驱动电机进行相应的调整,以保持系统的平衡。 运作原理主要是建立在一种被称为“动态稳定”(DynamicStabilizaTIon)的基本原理上,也就是车辆本身的自动平衡能力。以内置的精密固态陀螺仪(Solid-StateGyroscopes)来判断车身所处的姿势状态,透过精密且高速的中央微处理器计算出适当的指令后,驱动马达来做到平衡的效果。 目前市场上前期大部分是用ST的MCU来做为平衡车电机控制板的主控芯,因为ST对这个行业的design in更早。TI针对平衡车也推出C2000系列的DSP主控芯片,在性能上比ST的MCU更稳定,功耗更低,处理速度更快,在平衡车超低速行走或者站立时不会抖动。所在TI计划在平衡车上大力推广C2000系列的主控平台方案,并且由中电网信息技术有限公司全面负责推进工作。 中电网信息技术有限公司从2015年1月开始由TI指定负责全面开发平衡车客户,经过将近5个月的客户开发,共联系了上千家做平衡车的客户,最终确认有生产平衡车的客户共437家,但这437家平衡车客户中,真正具有自主研发能力的客户共102家,而其它335家都是买控制板回去然后进行成品组装销售。对于具有研发能力的客户,主推TI的C2000系列主控平台和TI电源管理芯片,还有TI的蓝牙和无线芯片等相关的可以用在平衡车上的电子元器件。而对于没有研发能力,买控制板的平衡车客户,将有研发能力的客户已经设计好的控制板或者方案直接推荐给买板子的客户,这样等于在帮客户卖板子的同时也在卖TI的芯片,与客户达到双嬴的局面。 最后附上平衡车电机控制板的原理图和已经研发成功的控制板实物图: TI主控芯片原理图: TI控制板方案和电源管理方案原理图: TI方案的电路图和实物图片:

    时间:2020-07-17 关键词: TI 平衡车

  • 前20大工业半导体厂商排名_TI领先很多排在榜首

    前20大工业半导体厂商排名_TI领先很多排在榜首

    近日,IHS Markit公布了前20大工业半导体厂商排名,ADI由于收购了Linear,排名一下子由第五跃居至第二。 小编在这里特别统计了各家公司的主要产品和面向的市场,文中只谈及关于工业部分,其他部分暂且不表。 1德州仪器  德州仪器作为世界上最大的模拟电路技术部件制造商,全球领先的半导体跨国公司,以开发、制造、销售半导体和芯片技术闻名于世,主要从事模拟、嵌入式处理以及无线技术,涵盖从数字通信娱乐到医疗服务、汽车系统以及各种广泛的应用。德州仪器(TI)总部位于美国德克萨斯州的达拉斯,并在25多个国家设有制造、设计或销售机构。 在工业领域,TI重点关注包括:家用电器、楼宇自动化、显示器及数字标牌、电子销售点 (EPOS)、工厂自动化与控制系统、智能电网与能源、工业运输、照明、医疗、保健与健康、电机驱动与控制、电力输送、宇航、航空电子设备和国防、测试和测量及其他。 提供的产品种类也颇为丰富,包括放大器、时钟和定时、数据转换器、接口、隔离、单片机、处理器、电源、电机驱动、传感器以及无线等产品。 2ADI ADI公司又名亚德诺半导体技术(上海)有限公司,是高性能模拟、混合信号和数字信号处理(DSP)集成电路(IC)设计、制造和营销方面世界领先的企业,产品涉及几乎所有类型的电子电器设备。自1965年成立以来,一直专注于积极应对电子设备中信号处理的相关工程挑战。全世界有超过100,000家客户在使用ADI的信号处理产品,这些产品在转换、调节、处理物理现象时发挥着十分重要的作用,例如将温度、压力、声音、光、速度和运动转换为电信号以用于各种电子设备。ADI关注重要的战略市场,在这些市场信号处理技术经常是帮助客户产品实现差异化的关键因素,如工业、汽车、通信和消费电子市场等。 ADI生产各种创新产品——包括数据转换器、放大器和线性产品、接口和隔离、射频(RF) IC、工业以太网、时钟和定时、电源管理产品、基于微机电系统(MEMS)技术的传感器、其他类型传感器以及信号处理产品,包括DSP和其他处理器。 ADI重点关注的工业领域包括:楼宇技术、能源、医疗、工业自动化、仪器仪表和测量以及安防和监控等。 3英特尔   英特尔是美国一家主要以研制CPU处理器的公司,是全球最大的个人计算机零件和CPU制造商,它成立于1968年,具有50年产品创新和市场领导的历史。 英特尔在工业应用中提供的主要产品包括处理器(桌面、服务器、Quark SoC)、FPGA、嵌入式平台芯片组等,围绕大数据和边缘计算、端对端的基于硬件和软件的安全解决方案,计算设备中整合工业工作负载,以及IT/OT 融合结合信息和运行技术等热门领域。 解决方案则包括PLC/PAC,工业PC,HMI人机交互,机器人,机器视觉,功能安全,马达控制,以及能源、智能建筑、医疗保健、智能城市、安防、零售等各领域。 4英飞凌 英飞凌科技公司于1999年4月1日在德国慕尼黑正式成立,是全球领先的半导体公司之一。其前身是西门子集团的半导体部门。

    时间:2020-07-15 关键词: TI 半导体

  • 世平TI智能家居照明系统介绍

    世平TI智能家居照明系统介绍

    大联大旗下世平集团推出TI智能家居照明系统解决方案。该解决方案使用TI SimpleLink 蓝牙低功耗MCU---CC2540T,这款高度集成的无线微控制器(MCU)能够提供-40℃至125℃的宽泛温度范围和适合工业应用的USB连接。借助TI的BLE-Stack软件以及支持内部更新的无线下载等示例应用,这款真正的集成式单芯片蓝牙低功耗解决方案能够帮助用户简化开发过程。 图示1-大联大世平代理的TI智能家居照明系统功能框架图 家居照明的发展从白炽灯、节能灯到LED灯,智能照明将是LED灯下一步发展必然的趋势。智能照明与LED灯比较,具有成本低、简单易用、可自动调光明暗度、自动调冷暖光以及可以直接透过手机控制,更容易让消费者提高意愿进行替换。大联大世平顺应此发展趋势,特推出TI智能家居照明系统解决方案,帮助客户顺利进入此热门市场。 图示2-大联大世平代理的TI智能家居照明系统解决方案示意图 方案特点: CC2540T工作温度高达125°C,非常适合任何LED解决方案; 简单和“随时开始”设计缩短您的时间到市场; 示例应用程序可以运行在广播的TIBLE多种IOS应用程序; 直接由智能手机的完全光控制(电源,颜色,颜色温度); RGBW LED大功率; IOS应用程序的例子包括在TI的BLE Mutlitool APP。 图示3大联大世平代理的TI智能家居照明系统方案图

    时间:2020-07-13 关键词: TI 世平 照明系统

  • TI推出首款集成双通道异步取样率转换器的8通道脉宽调制器音频处理器

    TI推出首款集成双通道异步取样率转换器的8通道脉宽调制器音频处理器

    符合 HD 标准的高集成芯片为家庭及专业音频产品提供两个音频源的无缝整合 德州仪器 (TI) 宣布推出业界首款在单芯片上集成双通道异步取样率转换器 (ASRC) 的 8 通道脉宽调制器 (PWM) 音频处理器。符合 HD 标准的 TAS5548 有助于家庭及专业音频设计人员无缝整合两个音频源,相比需要两个芯片的同类竞争解决方案,该方案可提高设计灵活性并降低成本。该器件不但 支持8 至 192 kHz 的取样速率,同时还可将其转换为 96 kHz 或 192 kHz 固定速率,无需创建、存储和修改系数。这可简化一体化蓝光家庭影院 (HTIB)、音视频接收器、迷你/微型组合设备以及条形音箱等数字多通道产品的设计。如欲了解更多详情或订购样片, TAS5548 的 40kHz 音频带宽不但符合 Dolby True HD 与 DTS-HD 标准,而且还可实现无与伦比的多通道性能。设计人员可通过丰富的音频处理功能优化产品,如 7 频带参数均衡 (EQ)、高低音控制、音量及响度控制、动态范围压缩 (DRC) 以及输入输出混合等。 TAS5548 的主要特性与优势 • 简化的多通道设计:两个集成型 4 通道 ASRC 内核可帮助音频系统设计人员在不修改系数的情况下切换取样率; • 出色的噪声性能:8 通道输出的 96 kHz 原生处理功能支持超低带外噪声与抖动抑制; • 设计灵活性:额外的麦克风及 I2S 输入可帮助 ASRC 混合两种不同取样速率源,从而可高度灵活地将一个麦克风与多达 8 个卡拉 OK 音轨对接; • 高效率电源设计:集成型智能能源管理器可提高工作效率,在达到电源阈值时,可通过中断主机处理器来限制音频系统峰值功率。对于高端音频系统而言,电源量控制可实现高能效的高功率性能; • 完整的音频解决方案:高度整合超低功耗 MSP430 Value Line 微控制器、具有立体声模数转换器 (ADC) 的 PCM9211 数字音频接口收发器以及 TAS5624A 与 TAS5614LA 150W 立体声/300W 单声道 PurePath HD 数字输入功率级器件。客户可通过这一完整的音频系统解决方案更快速地创建高性能音频系统。 工具与支持 TAS5548EVM 现已可订购,该评估板通过简单易用的 ControlConsole 图形开发套件提供,可简化音频产品的评估、配置与调试。ControlConsole 的图形用户界面 (GUI) 支持所有 TAS5548 功能的快速评估,包括 DRC、可编程 EQ 以及能源管理等。

    时间:2020-07-12 关键词: TI 音频 接收器

  • TI推出最新达芬奇DM369视频SoC,给市场带来最佳低照技术

    TI推出最新达芬奇DM369视频SoC,给市场带来最佳低照技术

    德州仪器 (TI) 宣布推出最新达芬奇 (DaVinci) 视频处理器 DM369,为百万像素 IP 摄像机市场带来业界最佳低照技术。通过该 DM369 视频片上系统 (SoC) ,视频安全制造商可充分利用优异的低照技术生成清晰锐利的画质。由于DM369 视频 SoC 与 DM36x 系列视频处理器引脚对引脚兼容,因此 TI 客户可便捷扩展其现有 IP 摄像机产品线,充分利用这一出色技术,为市场带来重要差异特性。TI 可扩展达芬奇平台提供创新解决方案,可帮助客户以低成本方式快速便捷地设计高度差异化的 IP 摄像机。 满足视频安全开发人员需求 TI 达芬奇 DM369 视频 SoC 为客户提供优异的低照性能,是同类竞争产品的 2 倍。基于 DM369 的 IP 摄像机可在室内停车场、黑暗巷道等极低照环境下生成清晰的影像,从而可帮助用户捕获汽车牌照、人面以及其它可能帮助官方破案的特性。该摄像机可采用 H.264/SVCT 格式实时压缩并发送这些过滤掉噪声的动态范围增强型视频。 TI 解决方案的主要差异化特性: • 支持高效率 H.264 压缩的 500 万像素及更高分辨率视频,可节省网络带宽与存储空间; • 同步多配置文件(基本/主流/高级)编码可提供最佳视频质量与兼容性; • 业界最佳集成型影像信号处理 (ISP) 技术支持逼真画质以及面部识别、视频稳定与鱼眼校正等特性。 各种工具软件简化开发 TI 可扩展 DM369 视频 SoC 可为安全监控制造商提供一个工具软件产业环境,加速产品上市进程。DM369 IP 摄像机参考设计包括原理图、布局与 BOM,可帮助客户重复利用其对 TI 达芬奇视频处理器的投资。此外,DM369 IP 参考设计符合 ONVIF 标准,帮助客户更便捷地集成摄像机与 NVR 及 VMS 系统。客户在设计解决方案并将其推出市场时,还可从 TI 基于市场最普及传感器的模块产业环境中选择。 TI IP 摄像机产品市场营销经理 Jacob Jose 表示:“TI 达芬奇视频处理器仍然是监控产品制造商的首选解决方案。凭借我们的第三代 3D 噪声过滤及 WDR 处理技术,TI 始终致力于通过我们业界最佳低照性能充分满足安全应用需求,让世界变得更安全。” 供货情况 TI 达芬奇 DM369 IP 摄像机参考设计现已开始提供,而 TI 达芬奇 DM369 视频 SoC 样片则将在四月底提供。此外,可联系当地 TI 销售代表或分销商销售代表了解 DM369 视频 SoC 价格。

    时间:2020-07-12 关键词: TI 宽带 视频处理器

  • 利用TI DLP技术结构光进行光学3D扫描特性介绍

    利用TI DLP技术结构光进行光学3D扫描特性介绍

    前言 三维(3D)扫描是一种功能强大的工具,可以获取各种用于计量设备、检测设备、探测设备和3D成像设备的体积数据。当设计人员需要进行毫米到微米分辨率的快速高精度扫描时,经常选择基于TI DLP技术的结构光系统。 3D扫描系统的诞生 简单的二维(2D)检测系统已经问世多年了,其工作机制通常是照亮物体并拍照,然后将拍摄图像与已知的标准2D参考件进行比较。 3D扫描则增加了获取体积信息的能力。引入z维数据可以测量物体的体积、平整度或粗糙度。对于印刷电路板(PCB)、焊膏和机加工零件检测等行业而言,测量上述附加几何结构特征至关重要,而这是2D检测系统无法达到的。此外,3D扫描还可用于医疗、牙科和助听器制造等行业。 坐标测量机(CMM)是收集3D信息的首批工业解决方案之一。 图 1.坐标测量机探头示例 图 2.利用结构光进行光学3D扫描 探针物理接触物体表面,并结合每个点的位置数据来创建3D表面模型(图1)。后来出现了用于3D扫描的光学方法,如:结构光(图2)。结构光是将一组图案投射到物体上并用相机或传感器捕捉图案失真的过程。然后利用三角计算方法计算数据并输出3D点云,从而生成用于测量、检查、检测、建模或机器视觉系统中各种计算的数据。光学3D扫描受到青睐的原因在于不接触被测物体,并且可以非常快速甚至实时地获取数据。 DLP技术可快速智能地生成光图像 对于光学3D扫描设备,DLP技术通常在系统中用于产生结构光。DLP芯片是一种高反射铝微镜阵列,称为数字微镜器件(DMD)。 当DMD与照明光源和光学器件相结合时,这种精密复杂的微机电系统(MEMS)就可以为各种投影系统和空间光调制系统提供助力。 由于DMD可灵活、快速、高度可编程的产生各种结构光图案,设计人员经常将DLP技术用于结构光应用。与具有固定图案集的激光线扫描仪或衍射光学元件(DOE)不同,它可以将不同位深的多种图案编程至一个DMD。基于DLP技术的结构光解决方案非常适合于需要达到毫米甚至微米精度的详细测量。 3D扫描系统的应用 3D AOI 3D自动光学检测(AOI)是一种用于生产制造环境的强大技术,可提供与零件质量相关的实时、在线、决定性的测量数据。例如,3D测量就非常适合用于PCB焊膏检测(SPI),因为它会测量出在元件放置之前沉积的焊膏的实际体积,有助于防止出现劣质焊点(图3)。在PCB的生产制造中,也会在元件放置、回流焊、最终检查和返工操作后进行在线3D AOI,最大限度地提高质量和可靠性。随着3D检测功能的日益普及,越来越多的在线工厂检测点选择采用3D AOI系统。 图 3.PCB 3D SPI示例 医疗 3D扫描技术在医疗行业中的应用飞速增长。例如,牙科中采用口腔内扫描仪(IOS)直接采集光学印模(图4)。在制作假体修复体时,如镶嵌物、高嵌体、顶盖和牙冠,需要达到微米级3D图像精度。IOS简化了牙医的临床操作程序,省却了对石膏模型的需求并减轻了患者的不适。 图 4.牙科口内扫描仪 另一个快速增长的应用行业是3D耳扫描。光学成像系统能够精确采集耳朵的3D模型,而无需使用硅胶耳印模。3D耳扫描未来还可用于为消费者定制耳塞、助听器及听力保护设备。 工业计量和检测 许多不同的工业计量和检测系统已经开始转向采用3D光学扫描技术。 光学3D表面检测显微镜是离线CMM系统的一种替代方案。此类显微镜可以测量更多关于高度、粗糙度以及计算机辅助设计(CAD)数据比较的特征。此外,生产机加工、铸造或冲压制品的工厂也是光学检测的另一大应用领域。 图 5.带有3D扫描仪的机器人手臂 它们可以更轻松和准确地进行X、Y、Z三轴方向的测量,从而提高质量保障。市场上也出现了在线3D视觉系统与机器人手臂相结合的解决方案(图5)。利用这些机器人解决方案可以极大地提高汽车(图6)和其他生产线工厂的速度和质量。在装配和生产过程中的特定阶段增设3D检测有助于及早发现质量问题,从而减少浪费和返工。3D扫描系统甚至可以在计算机数控(CNC)设备和3D打印机内运用,能够在生产制造过程中进行实时测量。 图 6.3D结构光扫描在汽车定位检测中的应用 专业级3D手持扫描仪 专业级3D手持扫描仪是为专业人士和业余爱好者提供的以3D数据格式采集实物完整细节特征的便携式工具(图7)。 所采集的数据可以用于产品设计、零件工程、3D内容创建或作为3D打印机的输入信息。例如,在线零售商可以通过对其产品进行3D扫描,以真实、高质量的3D模型(而非2D图片)在线呈现产品。游戏玩家可以对自己进行3D扫描并在游戏中创建自己的角色。 图 7.台式专业级3D扫描仪 3D生物识别和身份验证 3D扫描在生物识别和身份验证的应用方面不断发展,通常用于安全锁定或解锁设备、安检和金融交易。利用光学3D扫描技术来采集面部、指纹或虹膜特征是一种更安全可靠的生物识别方法,并会给黑客攻击和其他攻击带来更大的难度(图8)。 图 8.基于3D扫描的指纹绘制 集成DLP技术的系统设计优势 无论是检查PCB质量还是制作精确的牙科配件,基于DLP技术的结构光3D扫描设备都具备许多显而易见的系统优势。DMD微镜具有微秒级的快速切换性能以及每秒超过1000个图案的8位相移速率,从而能够达到高速数据采集率,以实现对在线测量非常有用的实时3D扫描。高速DLP芯片还具有编程灵活性,在运行中也可以动态地对图案进行选择和重新排序。这有助于确保将最佳图像应用于特定对象位置或特定视野内,同时也有助于提取用于分析的最准确的3D信息。可以控制图像的持续时间和亮度,确保物体反射的最佳光量,并使相机的动态范围最大化。 DLP技术可与各种光源结合使用,并兼容紫外(UV),可见光和近红外(NIR)波长(图9)。这为基于目标物体的反射率来定制3D扫描系统提供了额外的通用性。DLP芯片可以与多种光源和相机相结合的灵活性使得可以轻松创建一个设备来测量多个物体。在设计下一代3D扫描设备时,汽车、工业和医疗公司寻求DLP芯片是有意义的。在使用DLP技术设计解决方案时,系统集成商能够通过灵活的图像控制和新的结构光算法进行创新。 图 9.光谱 他们还可以优化光学架构,以匹配检查扫描的关键分辨率和照明要求。令人振奋的是,开发者可以利用先进的可编程性将3D扫描提升到新的水平,从而优化在光谱域、空间域和时间域中的性能。 DLP产品组合的考虑因素 TI先进光控制产品组合提供超越传统显示器的DMD和配套控制器成像功能。更值得一提的是,DMD芯片支持的波长范围在363 nm至2500 nm之间,二进制图形速率高达32 kHz,并且可提供更精确的像素精度控制。以下是具有先进光控制的DLP芯片组如何优化结构光系统的说明。 DMD特性  分辨率 — 在撰写这本刊物时,DMD的分辨率范围就达到了0.2至410万像素(MP)。在需要较大扫描区域或者光照强度较强的环境中时,倾向于使用较大的1-MP,2-MP或4-MP DMD。例如,汽车3D检测在组装和对准处理步骤时需要在明亮的工厂地板上的进行大区域扫描。小于1-MP的DMD倾向于放置在比较便携和低功耗的小型手持或台式设备中。  电源 — 最小的芯片组功耗低于200mW,非常适合便携式或电池供电系统。例如,口腔内扫描仪就是充分利用小型DMD的外形因素以及它具有适用于电池供电的低功耗特性的优势。  波长— 用户可以根据物体的反射特性在基于DLP技术的系统中调整颜色和照明强度。因为DMD可以与各种光源组合,包括灯,发光二极管(LED)和激光器。DMD针对紫外(363-420nm),可见光(400-700nm)和近红外(700-2,500nm)进行了优化。对于生物识别3D扫描解决方案,近红外波长因其不具有侵入性的特征而广受青睐。紫外线有时是优化金属反射特性的最佳选择。LED光学激光器是针对白光图像的节能单色解决方案。 控制器特性  预存模式— DLP控制器为可靠、高速的DMD控制提供了方便的接口。它们支持预存储的结构光图像,而无需外部视频处理器来传输图像。 图 10.1D图像示例 一些DLP控制器可以使用一维(1D)编码预先存储1000多个结构光行列图像(如,参见图10)。1D图像的特点是其信息可由单行或单列信息来表述。专业级3D手持扫描仪产品通常使用1D图像来降低成本并提高扫描速度。更先进的控制器支持多达400个预存储的2D全帧模式(例如,参见图11),根据应用程序的需要或被扫描的对象,可以更适应于X和Y。  图像精度和速度— DLP控制器设计用于显示适合机器视觉或数字曝光的图案,并支持可变高速图案显示速率,每秒高达32000个图案,且具有相机同步功能。这些图像速率对于高精度和高速3D扫描系统是至关重要的。 从简单到复杂的系统,DLP技术在设计定制的结构光系统硬件和算法时为客户提供了令人难以置信的图像灵活性。 用于3D扫描的DLP产品 TI提供了一系列的DLP芯片组,以适应不同的3D扫描要求,如下表1所示。有关DLP芯片的最新和完整列表,请参阅TI DLP技术。 表1.可以显示有用的3D扫描规范的DLP芯片组组合 DMD 微镜阵列 阵列 最佳波长 控制器 最大图像速率 高速预存图像显示 对角线 (二进制/ 8位) (2D or 1D) DLP2010 854 × 480 0.20” 420–700-nm DLPC3470 2,880-Hz / 360-Hz 仅1D DLP2010NIR 854 × 480 0.20” 700–2,500-nm DLPC3470 2,880-Hz / 360-Hz 仅1D DLP3010 1280 × 720 0.3” 420–700-nm DLPC3478 2,880-Hz / 360-Hz 仅1D DLP4500 912 × 1140 0.45” 420–700-nm DLPC350 4,225-Hz / 120-Hz 2D DLP4500NIR 912 × 1140 0.45” 700–2,500-nm DLPC350 4,225-Hz / 120-Hz 2D DLP4710 1920 × 1080 0.47” 420–700-nm DLPC3479 1,440-Hz / 120-Hz 仅1D DLP5500 1024 × 768 0.55” 420–700-nm DLPC200 5,000-Hz / 500-Hz 2D DLP6500 1920 × 1080 0.65” 420–700-nm DLPC900 9,523-Hz / 1,031-Hz 2D DLP6500 1920 × 1080 0.65” 420–700-nm DLPC910 11,574-Hz / 1,446-Hz — DLP7000 1024 × 768 0.7” 400–700-nm DLPC410 32,552-Hz / 4,069-Hz — DLP7000UV 1024 × 768 0.7” 400–700-nm DLPC410 32,552-Hz / 4,069-Hz — DLP9000 2560 × 1600 0.9” 400–700-nm DLPC900 9,523-Hz / 1,031-Hz 2D DLP9000X 2560 × 1600 0.9” 400–700-nm DLPC910 14,989-Hz / 1,873-Hz — DLP9500 1920 × 1080 0.95” 400–700-nm DLPC410 23,148-Hz / 2,893-Hz — DLP9500UV 1920 × 1080 0.95” 400–700-nm DLPC410 23,148-Hz / 2,893-Hz —

    时间:2020-07-08 关键词: TI dlp 3d

  • 最小,最快GaN驱动器,你知道吗?

    最小,最快GaN驱动器,你知道吗?

    什么是最小,最快GaN驱动器?它有什么特点?德州仪器(TI)(NASDAQ: TXN) 近日宣布推出两款新型高速氮化镓(GaN)场效应晶体管(FET)驱动器,进一步扩展了其业内领先的GaN电源产品组合,可在激光雷达(LIDAR)以及5G射频(RF)包络追踪等速度关键应用中实现更高效、性能更高的设计。LMG1020和LMG1210可在提供50 MHz的开关频率的同时提高效率,并可实现以往硅MOSFET无法实现的5倍更小尺寸解决方案。 凭借业内最佳的驱动速度以及1 ns的最小脉冲宽度,LMG1020 60-MHz低侧GaN驱动器可在工业LIDAR应用中使用高精度激光器。小型晶圆级芯片(WCSP)封装尺寸仅为0.8 mm x 1.2 mm,有助于最大限度地减少栅极环路寄生和损耗,进一步提升效率。 LMG1210是一款50-MHz半桥驱动器,专为高达200 V的GaN场效应晶体管而设计。该器件的可调死区时间控制功能能够将高速DC / DC转换器、电机驱动器、D类音频放大器及其它功率转换应用效率提高多达5%。设计人员可利用超过300 V / ns的业内最高共模瞬态抗扰度(CMTI)实现较高的系统抗噪声能力。 LMG1020和LMG1210的主要特点和优势 高速:这两款器件可提供超高速传播延迟(2.5 ns [LMG1020]和10 ns [LMG1210]),使电源解决方案比采用硅驱动器快50倍。另外,LMG1020能够提供高功率1ns激光脉冲,实现远程LIDAR应用。 高效率:这两款器件均可实现高效率设计。 LMG1210提供1 pF的低开关节点电容和用户可调的死区时间控制,可将效率提高多达5%。 功率密度:LMG1210中的死区时间控制集成功能可减少元件数量并提高效率,使设计人员能够将电源尺寸降低多达80%。功率密度增加的LMG1020,使LIDAR具有业内最小封装和最高分辨率。 TI GaN产品的优势 LMG1020和LMG1210是业界最大的GaN电源产品组合中的最新成员,从200V驱动器到80V和600V功率级。凭借超过1,000万小时的GaN工艺可靠性测试,TI提供可靠的GaN产品以满足对成熟和即用型解决方案的需求,为GaN技术带来数十年的硅制造专业技术和高级器件开发人才。 在APEC上参观TI展台 TI将于当地时间2018年3月4日至8日参展在得克萨斯州圣安东尼奥市举行的美国国际电力电子应用展览会(APEC),并展示其广泛的GaN产品组合以及GaN技术。 加快设计所需的支持和工具 设计人员可以使用LMG1020EVM-006和LMG1210EVM-012评估模块和SPICE模型快速轻松地评估这些新器件。工程师可以利用LIDAR的纳秒激光驱动器参考设计和高速DC / DC转换器的多兆赫GaN功率级参考设计,快速开始他们的氮化镓设计。 封装和供货情况 LMG1020和LMG1210的原型样品现已在TI商店和公司的授权分销网络上提供。 LMG1020采用WCSP封装,而LMG1210采用四方扁平无引脚(QFN)封装。以上就是最小,最快GaN驱动器解析,希望能给大家帮助。

    时间:2020-07-08 关键词: TI 电源 gan

  • 等等党的胜利!索泰显卡618终极大促启动:700元羊毛等你薅

    等等党的胜利!索泰显卡618终极大促启动:700元羊毛等你薅

    又又又又又到了一年618!曾经的618只是一天的狂欢,近年周期越拉越长,前后持续半个多月,相信这期间已经有不少小伙伴忍不住抢先剁手了,可能有的人也感到麻木了,但是高潮当然要等到6月18日当天! 现在,等等党终于胜利了!今年618大促期间,显卡真的出奇便宜,可以说买到就是赚到,现在我们拿到了索泰显卡京东618期间的优惠价格单,尤其是6月18日0点到2点的疯狂两小时,不容错过。 【温馨提示】:受京东销售策略影响,显卡产品价格于618当日可能出现上下浮动,以下爆料价格仅供参考,具体请以产品购买页面显示的价格为准! 1、索泰RTX 2080 Ti至尊PLUS OC8 原价9199元,618狂欢价8499元,瞬间省下700元,还支持白条12期,算下来一天也就20来块钱。 2、索泰RTX 2070 SUPER至尊PLUS OC V2 618狂欢价3599元+白条6期免息 用料扎实,表现稳定,是备受玩家欢迎的显卡系列之一,全新的3D-STORM立体散热系统。 3、索泰RTX 2070 SUPER X-GAMING OC V2 618狂欢价:3399元+白条3期 疯狂2小时:叠加100元优惠券,到手价3299元 索泰专为大众游戏玩家定制的显卡,X-GAMING系列兼顾实用性和性价比,这也是众多2070 SUPER中最为均衡的产品之一,五热管三风扇强劲散热模组。 4、索泰RTX 2060 SUPER X-GAMING OC V2 618狂欢价:2499元+白条3期免息 RGB信仰灯,坚固背板,3热管3风扇,该有的都有了。 5、索泰RTX 2060 SUPER霹雳版OC HA 618狂欢价:2399元 1080p分辨率下,RTX 2060 SUPER其实已经足够吊打目前市面上大部分游戏了。 6、索泰RTX 2060至尊PLUS OC V2 618狂欢价:2199元+白条3期免息 第II代白金效能用料,3D-STORM ARGB 5热管四风扇散热系统,光追入门首选。 7、索泰RTX 2060霹雳版OC HA 618狂欢价:1899元+白条3期免息 堆料供电稳如狗。 8、索泰GTX 1660 SUPER X-GAMING OC 618狂欢价:1499元+白条3期免息 久经考验的X-GAMING系列,性价比出色,2热管3风扇鳍片设计。 9、索泰GTX 1660 X-GAMING OC HA 618狂欢价:1349元 GTX1660可以说是很多大众玩家的选择了,1080P分辨率下玩多数3A大作和吃鸡等高配网游都不是问题,LOL这种更不用说了。 10、索泰GTX 1650 SUPER毁灭者PA 618狂欢价:1099元+白条3期免息 疯狂2小时:999元+ 白条3期免息 短小精干小钢炮,释放更多机箱空间,隐蔽工程不缩水,加强散热减少电损耗,经久耐用。 11、索泰GTX 1650毁灭者GDDR6 618狂欢价:999元+白条3期免息 全新升级GDDR6显存的索泰GTX 1650,带来了更快的传输速率,足够应付工作需求和多数主流网游啦。 更多优惠产品,索泰13周年庆活动,请前往索泰京东618大促页面查看。 视频会员活动汇总>> 爱奇艺视频会员限时优惠5折 优酷视频会员年卡5折购(99元) 腾讯视频会员年费99元/京东plus联合年卡128元 芒果TV 13个月 98元(6.16-6.22)

    时间:2020-07-07 关键词: TI rtx 2080 显卡 618 索泰 大促

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