面向研发型客户项目 法国研究机构CEA-Leti提升三维芯片封装能力
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法国研究机构CEA-Leti最近开始提升其三维芯片封装的生产能力，CEA-Leti在Grenoble 有一条300 mm 的CMOS 研发型生产线，目前专门用于三维芯片封装的试验。
CEA-Leti 称他们已经可以向客户提供 200 和 300 mm 晶圆的多种封装技术和工具，其中包括三维定向光刻、深度刻蚀、介质淀积、表面金属化等。
CEA-Leti ramps up 300-mm 3-D fab
Peter Clarke
France's CEA-Leti research center in Grenoble has begun to ramp up production on its 300-mm wafer fabrication facility dedicated to 3D-integration applications.
By adding this technology to its existing 300-mm CMOS R&D line, Leti now can offer heterogeneous integration technologies to customers on both 200- and 300-mm diameter wafers.
The line is dedicated to R&D and prototyping and can provide 3-D oriented lithography, deep etching, dielectric deposition, metallization, wet etching and packaging tools that will be available for Leti's partner and customers.
Leti claims to have a large portfolio of through-silicon vias (TSVs) as well as capabilities in alignment, bonding, thinning, and interconnects in specific integration schemes for manufacturing optimized die stacks.
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关键字： TI
