ATMI公司与IBM公司达成新材合作研发协议

Danbury, Conn. — 2012年7月11日— ATMI, Inc. (NASDAQ-GS: ATMI) 今天宣布与IBM达成合作研发协议（JDA），这项协议旨在应对14nm及更小技术节点的关键湿法工艺(wet process)挑战。该协议将在未来两年内，在前道和后道清洗所用的先进化学产品上进行广泛的开发和商业化合作。

“这项与IBM的最新协议在两家公司之间建立了多重的合作和努力。为解决下一代技术节点的挑战，这样的合作模式对供应商和关键客户来说是至关重要的。”ATMI微电子部门执行副总裁兼总经理Tod Higinbotham说，“将该协议的合作模式与我们的湿法工艺高效生产力发展能力相结合，意味着我们可以更快的发现并解决问题，保证我们的客户将他们的资源集中于其它关键的挑战上。”

“这项与ATMI的协议进一步加强了IBM的合作发展战略，以加快半导体14nm和10nm技术节点高质量工艺和材料的解决方案的研发。”IBM半导体工艺研发副总裁George Gomba说。

ATMI, Inc. (NASDAQ-GS: ATMI) today announced it has entered into a new Joint Development Agreement (JDA) with IBM that is focused on addressing critical wet process challenges at the14nm technology node and beyond. The agreement has a broad scope for developing and commercializing advanced chemical formulations for both Front End of Line (FEOL) and Back End of Line (BEOL) cleans applications over a two-year period.

“This latest agreement with IBM builds upon multiple joint efforts between our two companies to-date. It is confirmation of how critically important the collaboration model has become to both suppliers and our key customers when identifying solutions for the next nodes” stated Tod Higinbotham, ATMI Executive Vice President and General Manager, Microelectronics. “Combining the engagement model with our High Productivity Development capability for wet processes, means we can more quickly identify and resolve issues, allowing our customers to focus their resources on other critical challenges.”

"This engagement with ATMI further strengthens IBM's collaborative development strategy to enable and accelerate high quality process and material solutions for semiconductor products at the 14nm and 10nm nodes," said George Gomba, IBM VP of Semiconductor Process R&D.