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[导读]IMEC日前宣布,已经为14nm逻辑芯片发布一个早期版本的PDK(工艺开发套件)。该PDK是业界第一个解决了14nm技术节点,目的是为引进一些新型关键技术,如FinFET技术和EUV光刻技术等。PDK接下来将向IMEC的合作伙伴提供持

IMEC日前宣布,已经为14nm逻辑芯片发布一个早期版本的PDK(工艺开发套件)。

该PDK是业界第一个解决了14nm技术节点,目的是为引进一些新型关键技术,如FinFET技术和EUV光刻技术等。PDK接下来将向IMEC的合作伙伴提供持续更新。IMEC和其合作伙伴正在开发14nm测试芯片,将在2012年下半年发布使用该PDK。

With this PDK release, imec leads the way to an industry-standard 14nm PDK. In addition, the PDK anticipates the introduction of a number of new technologies at the 14nm node. The main example is the use of FinFET transistors, which have a larger drive per unit footprint and higher performance at low supply voltages compared to the traditional planar technologies. Evolutions of this PDK will gradually also introduce the use of high-mobility channel materials. The PDK includes elements of both immersion- and EUV lithography, opening the way for a gradual transition from 193nm immersion to EUV lithography.

This first 14nm PDK contains all elements for design assessment of the 14nm node through device compact models, parasitic extraction, design rules, parameterized cells (pcells), and basic logic cells. Starting from the PDK, imec and its partners are now designing a first test chip. This chip, planned for the 2nd half of 2012, will allow testing the device-, interconnect-, process- and litho assumptions, as well as performance and power of circuits implemented at the tight area budgets of the 14nm node.

The 14nm PDK was developed in the frame of imec’s INSITE program, and together with all the partners involved in this collaborative affiliation program. Through the INSITE program, imec offers its partners a very early insight in technologies. This way, companies can anticipate upcoming developments and start designing the more advanced systems and applications today, and get them on the market faster.



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