德州仪器300-mm RFAB晶圆厂内部首曝光
时间：2011-07-05 07:27:00
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[导读]作为少数被邀的几家媒体代表之一，最近收到来自德州仪器公司（Texas Instruments Inc.）的邀请函，有幸参加了RFAB—德州仪器旗下新开的在半导体工业首家300-mm模拟晶圆厂，并为全球首家通过LEED（Low Energy Electro
作为少数被邀的几家媒体代表之一，最近收到来自德州仪器公司（Texas Instruments Inc.）的邀请函，有幸参加了RFAB—德州仪器旗下新开的在半导体工业首家300-mm模拟晶圆厂，并为全球首家通过LEED（Low Energy Electron Diffraction，是美国民间绿色建筑认证奖项）认证的晶圆厂。
RFAB最初在2004年正式破土动工，并于2007年竣工。但是，该晶圆厂足足延迟闲置了两年多，直至德州仪器遇到性价比非常高的收购—因为闪存芯片厂商Qimonda AG宣布破产，整条300-mm设备产品线以非常低的折扣价率，只有1.725亿美元，德州仪器便顺利收购该产品线。
据Paul James Fego，德州仪器技术与制造全球副总裁表示，如果没有Qimonda设备收购案的话，RFAB到现在可能就只有一条200-mm产品线模拟晶圆厂。 “我们拥有硬件设施建设，我们便拥有设备仪器的机会，”他说，“我们当时便已意识到，300-mm将会是未来的主宰。”
TI‘s 1.1-million square foot RFAB includes about 250，000 square feet of cleanroom space.
德州仪器1.1百万平方英尺的RFAB晶圆厂，包括25万平方英尺无尘净化室
正在走向全面生产
The area of RFAB nearest the observation window includes more than a dozen process tools， including ion implantation systems made by Axcelis Inc. and Varian Semiconductor Equipment Associates Inc.
在靠近RFAB观察窗口，可以看到不少于12台相关操作设备，包括Axcelis Inc. and Varian Semiconductor Equipment Associates制造的离子移植系统
在2009年9月几周内，德州仪器通告300-mm模拟产品晶圆厂将正常营业，当时，Qimonda的设备已经被运到德州的Richardson市，距德州仪器总部和Dallas晶圆厂集中地也就只有几英里。Tom Weichel，RFAB晶圆厂经理。（Weichel说，在RFAB办公室的内部，甚至连家具或办公设施都是来自于Qimonda）。
在上一年，RFAB已经实现全面生产。晶圆厂的所有设施，包括占地25万平方英尺的净化室，目前产能在350片晶圆每天，将在2011年底实现600到700片日均产能，据德州仪器发言人宣称。
Representatives from Texas Instruments Inc. last week invited a few members of the media to Richardson， Texas， for a tour of RFAB—the semiconductor industry’s first 300-mm analog fab and first LEED certified fab.
TI originally broke ground on the shell for RFAB in 2004. Work was completed by 2007， but the shell sat idle for more than two years until TI happened on a sweetheart of a deal—scooping up a boatload of 300-mm production equipment from bankrupt memory chip vendor Qimonda AG for the deeply discounted rate of $172.5 million.
According to Paul James Fego， vice president of worldwide manufacturing for TI‘s Technology and Manufacturing group， RFAB would have been a 200-mm analog fab—if not for the deal that was available on the Qimonda equipment. “We had the building built， we had an equipment opportunity，” he said. “And we knew the breadth and the volume of our analog business could fill a 300-mm fab.”
Ramping toward full production
Within weeks of the September 2009 announcement that TI planned to open the first 300-mm analog fab， the Qimonda equipment began arriving in Richardson， just a few miles north of TI’s headquarters and a cluster of TI fabs in Dallas. Tom Weichel， manager of RFAB. （Weichel said even the furniture in RFAB‘s office space came from Qimonda）。
RFAB started ramping toward full production at the end of last year. The facility， which includes about 250，000 square feet of cleanroom space， is currently running about 350 wafers per day， ramping to between 600 and 700 wafers per day by the end of 2011， according to a TI spokesperson .
RFAB最初在2004年正式破土动工，并于2007年竣工。但是，该晶圆厂足足延迟闲置了两年多，直至德州仪器遇到性价比非常高的收购—因为闪存芯片厂商Qimonda AG宣布破产，整条300-mm设备产品线以非常低的折扣价率，只有1.725亿美元，德州仪器便顺利收购该产品线。
据Paul James Fego，德州仪器技术与制造全球副总裁表示，如果没有Qimonda设备收购案的话，RFAB到现在可能就只有一条200-mm产品线模拟晶圆厂。 “我们拥有硬件设施建设，我们便拥有设备仪器的机会，”他说，“我们当时便已意识到，300-mm将会是未来的主宰。”
TI‘s 1.1-million square foot RFAB includes about 250，000 square feet of cleanroom space.
德州仪器1.1百万平方英尺的RFAB晶圆厂，包括25万平方英尺无尘净化室
正在走向全面生产
The area of RFAB nearest the observation window includes more than a dozen process tools， including ion implantation systems made by Axcelis Inc. and Varian Semiconductor Equipment Associates Inc.
在靠近RFAB观察窗口，可以看到不少于12台相关操作设备，包括Axcelis Inc. and Varian Semiconductor Equipment Associates制造的离子移植系统
在2009年9月几周内，德州仪器通告300-mm模拟产品晶圆厂将正常营业，当时，Qimonda的设备已经被运到德州的Richardson市，距德州仪器总部和Dallas晶圆厂集中地也就只有几英里。Tom Weichel，RFAB晶圆厂经理。（Weichel说，在RFAB办公室的内部，甚至连家具或办公设施都是来自于Qimonda）。
在上一年，RFAB已经实现全面生产。晶圆厂的所有设施，包括占地25万平方英尺的净化室，目前产能在350片晶圆每天，将在2011年底实现600到700片日均产能，据德州仪器发言人宣称。
Representatives from Texas Instruments Inc. last week invited a few members of the media to Richardson， Texas， for a tour of RFAB—the semiconductor industry’s first 300-mm analog fab and first LEED certified fab.
TI originally broke ground on the shell for RFAB in 2004. Work was completed by 2007， but the shell sat idle for more than two years until TI happened on a sweetheart of a deal—scooping up a boatload of 300-mm production equipment from bankrupt memory chip vendor Qimonda AG for the deeply discounted rate of $172.5 million.
According to Paul James Fego， vice president of worldwide manufacturing for TI‘s Technology and Manufacturing group， RFAB would have been a 200-mm analog fab—if not for the deal that was available on the Qimonda equipment. “We had the building built， we had an equipment opportunity，” he said. “And we knew the breadth and the volume of our analog business could fill a 300-mm fab.”
Ramping toward full production
Within weeks of the September 2009 announcement that TI planned to open the first 300-mm analog fab， the Qimonda equipment began arriving in Richardson， just a few miles north of TI’s headquarters and a cluster of TI fabs in Dallas. Tom Weichel， manager of RFAB. （Weichel said even the furniture in RFAB‘s office space came from Qimonda）。
RFAB started ramping toward full production at the end of last year. The facility， which includes about 250，000 square feet of cleanroom space， is currently running about 350 wafers per day， ramping to between 600 and 700 wafers per day by the end of 2011， according to a TI spokesperson .
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