在压力下成长的封装材料市场

半导体封装材料市场在2009年收缩，出货量及材料消耗量在今年二季度开始恢复，并且有望延续到四季度。塑料封装材料（包括热介面材料）预计将达到158亿美元，较2008年的172亿美元下降8%。由于材料消耗量的增加，该市场有望在2010年达到176亿美元，到2013年达到201亿美元。对于封装材料市场的关键部分来说，直到2011年，市场将稳步增长。

Packaging Material Segment主要封装材料

半导体封装市场的增长领域包括：倒装芯片、晶圆级封装、BGA球栅列阵、应用引线框架的芯片级封装(CSP)、堆叠芯片封装以及系统级封装/多芯片封装。随着应用需求的不断增加，越来越多传统的封装技术将运用于实际产品中。

在不断推进封装技术的过程中，现有材料的改进以及新兴材料的发展都是十分关键的。以下为部分观察报告：

1.有机基板

对于有机衬底材料来说，倒装芯片应用取得了卓越进步。倒装PBGA的成长驱动主要来自于对电性能，芯片上电源分布以及日益受限的Pad设计的需求。波形系数及需求一直驱动着处理器及无线应用设备中线焊到倒装芯片的转换。未来几年，随着供应的增加以及不断改善的材料利用率及生产良率，基板价格有望下降。

2.引线框架

目前在引线框架生产过程中，生产商专注于提升电镀及表面处理能力，以满足产品的湿度敏感性要求。由于铜的价格不断上涨，供应商不断评估新材料以降低成本。部分引线框架厂商采用中国本土企业生产的引线框架合金作为生产的原材料。

3.塑封料

设备商及封装厂商强调了低K电介质设备的兼容性、超细间距引线，铜键合丝对于塑封材料的发展也极为重要，需要利用塑封料来改善较薄以及堆叠封装中的翘曲。改善塑封料对于传统的传递型封装技术中的细间距填充，包括过模压填充应用来说，是必要的。

4.键合丝

金线供应商正积极发展合金线、控制金属微观结构属性来满足不同封装设计及form factor中的可靠性需求。而关系到供应商及他们客户的切身问题是不断上涨的金价。因此，不断向更小直径转移的金线成为了引人关注的焦点，近70%的出货金线均是直径小于25微米。铜金线的使用已越来越频繁，已占总键合丝市场的5%以上。

目前对于新材料发展的趋势和驱动力就是产业范围内降低半导体封装的成本压力。所有的封装材料市场都面临着发展低成本解决方案的压力。供应链上的各个企业需要共同协作来推动新材料的发展及成本降低。

所有信息均来自最近SEMI与TechSearch International合作出版的市场调研“全球半导体封装材料市场展望──2009-2010版”。报告深度采访了全球超过140家半导体制造商、封装及封装材料供应商。

若需订阅“全球半导体封装材料市场展望──2009-2010版”，请联系Dr. Dan P. Tracy, research development director, Industry Research and Statistics, SEMI ，email at dtracy@semi.org

电话：1.408.943.7987 传真：1.408.943.7915。

Growing Packaging Materials Market under Pressure

Cost Reduction Pressures Impact the Market

By Jan Vardaman, TechSearch International, and Dan Tracy, SEMI

While the semiconductor packaging materials market will contract in 2009, a recovery in unit shipments and materials consumption occurred in the second quarter of the year and looks to continue through the fourth quarter. As a result, plastic packaging materials (including thermal interface materials) will be an estimated $15.8 billion, down 8% from the $17.2 billion reported in 2008. This market is forecast to reach $17.6 billion in 2010 and grow to $20.1 billion by 2013 as material consumption is projected to increase. Steady unit growth is expected through 2011 for key segments of the packaging materials market.

Packaging Material Segment

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Going forward, semiconductor packaging growth areas include flip chip, wafer-level packaging (WLP), ball grid array (BGA), leadframe-based chipscale packaging (CSP), stacked die packages, and system-in-package (SiP)/multichip packages. More traditional packaging technologies will see demand continue to increase for some applications, though stagnant in others and, for some basic form factors, to continue to decline. Improvements in existing materials and the development of new materials are critical in advancing packaging technologies. Here are some observations for specific segments:

1. Organic Substrates

For the organic substrate materials, flip chip applications have grown dramatically. The drivers for flip chip PBGAs continue to be electrical performance, on-chip power distribution, and pad limited designs. Form factor and performance are driving the shift from wire bond to flip chip for processors and other devices used in wireless applications. Over the next several years, substrate prices are expected to decline as a result of increased supply and improved material utilization and yield.

2. Leadframes

On-going technological enhancements in leadframe manufacturing focus on plating and surface treatment technologies in an effort to achieve desired moisture sensitivity specifications for packages. Suppliers continue to report the evaluation of new materials to lower costs in light of rising copper prices. Part of this is assessing and using leadframe alloys supplied by China-based companies.

3. Mold Compounds

Input from device makers and packaging subcontractors highlight compatibility with low-k dielectric devices, fine and high-density pitch wire, as well as copper bonding wire as important areas for on-going materials development for mold compounds. Materials are needed to reduce warpage in thin and stacked packages. Improved mold compounds are required for thin gap filling for conventional transfer mold technology, including over-molded underfill applications.[!--empirenews.page--]

4. Bonding Wire

Wire suppliers continue to develop new wire alloys and control metal microstructures with properties to meet the various, yet demanding requirements in processing and packaging reliability for differing packaging designs and form factors. Of concern to suppliers and their customers is the rising price of gold metal. As a result, the migration to smaller diameter wire has been noticeable with almost 70% of the wire shipped less than 25 micron in diameter. Use of copper wire is increasing and it now represents over 5 percent of the total wire market.

Clearly entwined with the trends and drivers for new materials development are the industry-wide pressures to reduce the cost of electronics and semiconductor packages.

All segments of the packaging materials market are under pressure to develop lower cost solutions. Companies across the supply chain will need to collaborate to balance the needs of new materials development and cost reduction efforts.

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All of the information in this article was derived from a recently completed market research study, Global Semiconductor Packaging Materials Outlook—2009-2010 Edition, produced by SEMI and TechSearch International. In developing this report, over 140 in-depth interviews were conducted with semiconductor manufacturers, packaging subcontractors and packaging materials suppliers throughout the world.

TO ORDER YOUR COPY of Global Semiconductor Packaging Materials Outlook—2009-2010 Edition, please contact Dr. Dan P. Tracy, research development director, Industry Research and Statistics, SEMI via email at dtracy@semi.org, or telephone 1.408.943.7987 or facsimile 1.408.943.7915. You can also click here for sample, pricing, and ordering information.