当前位置:首页 > 嵌入式 > 嵌入式教程
[导读]Virtex-6 FPGA ML605开发评估技术方案

Virtex-6 FPGA适合用有线通信,无线基础设备和广播设备等领域.本文介绍了Virtex-6 FPGA主要特性,以及骨干网OTU-4成帧与EFEC框图, LTE 2x2无线电设计框图和支持SD/HD/3G-SDI接口的新一代交换框图, Virtex®-6 FPGA ML605评估套件主要特性和详细电路图.

The Virtex®-6 family provides the newest, most advanced features in the FPGA market. Virtex-6 FPGAs are the programmable silicon foundation for Targeted Design Platforms that deliver integrated software and hardware components to enable designers to focus on innovation as soon as their development cycle begins. Using the third-generation ASMBL™ (Advanced Silicon Modular Block) columnbased architecture, the Virtex-6 family contains multiple distinct sub-families. This overview covers the devices in the LXT, SXT, and HXT sub-families. Each sub-family contains a different ratio of features to most efficiently address the needs of a wide variety of advanced logic designs. In addition to the high-performance logic fabric, Virtex-6 FPGAs contain many built-in system-level blocks. These features allow logic designers to build the highest levels of performance and functionality into their FPGA-based systems. Built on a 40 nm state-of-theart copper process technology, Virtex-6 FPGAs are a programmable alternative to custom ASIC technology. Virtex-6 FPGAs offer the best solution for addressing the needs of high-performance logic designers, high-performance DSP designers, and high performance embedded systems designers with unprecedented logic, DSP, connectivity, and soft microprocessor capabilities.

Virtex-6 FPGA 主要特性:

• Three sub-families:

• Virtex-6 LXT FPGAs: High-performance logic with advanced serial connectivity

• Virtex-6 SXT FPGAs: Highest signal processing capability with advanced serial connectivity

• Virtex-6 HXT FPGAs: Highest bandwidth serial connectivity

• Compatibility across sub-families

• LXT and SXT devices are footprint compatible in the same package

• Advanced, high-performance FPGA Logic

• Real 6-input look-up table (LUT) technology

• Dual LUT5 (5-input LUT) option

• LUT/dual flip-flop pair for applications requiring rich register mix

• Improved routing efficiency

• 64-bit (or two 32-bit) distributed LUT RAM option per 6-input LUT

• SRL32/dual SRL16 with registered outputs option

• Powerful mixed-mode clock managers (MMCM)

• MMCM blocks provide zero-delay buffering, frequency synthesis, clock-phase shifting, inputjitter filtering, and phase-matched clock division

• 36-Kb block RAM/FIFOs

• Dual-port RAM blocks

• Programmable

- Dual-port widths up to 36 bits

- Simple dual-port widths up to 72 bits

• Enhanced programmable FIFO logic

• Built-in optional error-correction circuitry

• Optionally use each block as two independent 18 Kb blocks

• High-performance parallel SelectIO™ technology

• 1.2 to 2.5V I/O operation

• Source-synchronous interfacing using ChipSync™ technology

• Digitally controlled impedance (DCI) active termination

• Flexible fine-grained I/O banking

• High-speed memory interface support with integrated write-leveling capability

• Advanced DSP48E1 slices

• 25 x 18, two’s complement multiplier/accumulator

• Optional pipelining

• New optional pre-adder to assist filtering applications

• Optional bitwise logic functionality

• Dedicated cascade connections

• Flexible configuration options

• SPI and Parallel Flash interface

• Multi-bitstream support with dedicated fallback reconfiguration logic

• Automatic bus width detection

• System Monitor capability on all devices

• On-chip/off-chip thermal and supply voltage monitoring

• JTAG access to all monitored quantities

• Integrated interface blocks for PCI Express® designs

• Compliant to the PCI Express Base Specification 2.0

• Gen1 (2.5 Gb/s) and Gen2 (5 Gb/s) support with GTX transceivers

• Endpoint and Root Port capable

• x1, x2, x4, or x8 lane support per block

• GTX transceivers: up to 6.6 Gb/s

• Data rates below 480 Mb/s supported by oversampling in FPGA logic.

• GTH transceivers: 2.488 Gb/s to beyond 11 Gb/s

• Integrated 10/100/1000 Mb/s Ethernet MAC block

• Supports 1000BASE-X PCS/PMA and SGMII using GTX transceivers

• Supports MII, GMII, and RGMII using SelectIO technology resources

• 2500Mb/s support available

• 40 nm copper CMOS process technology

• 1.0V core voltage (-1, -2, -3 speed grades only)

• Lower-power 0.9V core voltage option (-1L speed grade only)

• High signal-integrity flip-chip packaging available in standard or Pb-free package options

Virtex®-6 FPGA典型应用:


图1.骨干网OTU-4成帧和EFEC框图(有线通信)

图2. LTE 2x2无线电设计框图(无线基础设备)

图3.支持SD/HD/3G-SDI接口的新一代交换框图(广播通信)
[!--empirenews.page--]
Virtex®-6 FPGA ML605评估套件

The Virtex®-6 FPGA ML605 Evaluation Kit provides a development environment for system designs that demand high-performance, serial connectivity and advanced memory interfacing. The ML605 is supported by pre-verified reference designs and industry-standard FPGA Mezzanine Connectors (FMC) which allow scaling and customization with daughter cards. Integrated tools help streamline the creation of elegant solutions to complex design requirements.

The ML605 board enables hardware and software developers to create or evaluate designs targeting the Virtex®-6 XC6VLX240T-1FFG1156 FPGA.

The ML605 provides board features common to many embedded processing systems. Some commonly used features include: a DDR3 SODIMM memory, an 8-lane PCI Express® interface, a tri-mode Ethernet PHY, general purpose I/O, and a UART.  Additional user desired features can be added through mezzanine cards attached to the onboard high-speed VITA-57 FPGA Mezzanine Connector (FMC) high pin count (HPC) expansion connector, or the onboard VITA-57 FMC low pin count (LPC) connector.

This information includes:

• Current version of this user guide in PDF format

• Example design files for demonstration of Virtex-6 FPGA features and technology

• Demonstration hardware and software configuration files for the System ACE™ CF controller, Platform Flash configuration storage device, and linear flash chip

• Reference design files

• Schematics in PDF and DxDesigner formats

• Bill of materials (BOM)

• Printed-circuit board (PCB) layout in Allegro PCB format

• Gerber files for the PCB (Many free or shareware Gerber file viewers are available on the internet for viewing and printing these files.)

• Additional documentation, errata, frequently asked questions, and the latest news

Virtex®-6 FPGA ML605评估套件主要特性:

The ML605 provides the following features:

• 1. Virtex-6 XC6VLX240T-1FFG1156 FPGA

• 2. 512 MB DDR3 Memory SODIMM

• 3. 128 Mb Platform Flash XL

• 4. 32 MB Linear BPI Flash

• 5. System ACE CF and CompactFlash Connector

• 6. USB JTAG

• 7. Clock Generation

♦ Fixed 200 MHz oscillator (differential)

♦ Socketed 2.5V oscillator (single-ended)

♦ SMA connectors (differential)

♦ SMA connectors for MGT clocking

• 8. Multi-Gigabit Transceivers (GTX MGTs)

♦ FMC - HPC connector

♦ FMC - LPC connector

♦ SMA

♦ PCIe

♦ SFP Module connector

♦ Ethernet PHY SGMII interface

• 9. PCI Express Endpoint Connectivity

♦ Gen1 8-lane (x8)

♦ Gen2 4-lane (x4)

• 10. SFP Module Connector

• 11. 10/100/1000 Tri-Speed Ethernet PHY

• 12. USB-to-UART Bridge

• 13. USB Controller

• 14. DVI Codec

• 15. IIC Bus

♦ IIC EEPROM - 1 KB

♦ DDR3 SODIMM socket

♦ DVI CODEC

♦ DVI connector

♦ FMC HPC connector

♦ FMC LPC connector

♦ SFP module connector


图4.ML605和外设框图

图5.ML605板外形图[!--empirenews.page--]

图6.ML605电路图(1)

图7.ML605电路图(2)

图8.ML605电路图(3)

图9.ML605电路图(4)

图10.ML605电路图(5)

图11.ML605电路图(6)

图12.ML605电路图(7)

图13.ML605电路图(8)

图14.ML605电路图(9)

图15.ML605电路图(10)

本站声明: 本文章由作者或相关机构授权发布,目的在于传递更多信息,并不代表本站赞同其观点,本站亦不保证或承诺内容真实性等。需要转载请联系该专栏作者,如若文章内容侵犯您的权益,请及时联系本站删除。
换一批
延伸阅读

最近为什么越来越多的研究开始利用FPGA作为CNN加速器?FPGA与CNN的相遇究竟能带来什么神奇效果呢?原来,FPGA拥有大量的可编程逻辑资源,相对于GPU,它的可重构性以及高功耗能效比的优点,是GPU无法比拟的;同时...

关键字: FPGA 可编程逻辑资源 GPU

FPGA的应用领域包罗万象,我们今天来看看在音乐科技领域及医疗照护的智能巧思。

关键字: FPGA 科技领域 智能

强大的产品可降低信号噪音并提高分辨率与动态

关键字: Spectrum仪器 数字化仪 FPGA

最近某项目采用以太网通信,实践起来有些奇怪,好像设计成只能应答某类计算机的ICMP(ping)命令, 某类计算机指的是Windows特定系统,其他系统发送ping都不能正确识别。

关键字: 嵌入式Linux FPGA 协议

近两年,国外厂商的FPGA芯片价格飙升,由于价格,货期,出口管制等多方面因素的影响,很多公司都在寻找FPGA国产化替代方案。我工作中正在使用的几款芯片也面临停产的风险,用一片少一片,了解到国产FPGA发展的也不错,完全自...

关键字: FPGA 芯片 EDA

本篇是FPGA之旅设计的第十二例,在前面的例程中,完成了DS18B20温度传感器数据的采集,并且将采集到的数据显示在数码管上。由于本例将对温湿度传感器DHT11进行采集,而且两者的数据采集过程类似,所以可以参考一下前面的...

关键字: FPGA DS18B20温度传感器

这是FPGA之旅设计的第十三例啦,本例是一个综合性的例程,基于OLED屏幕显示,和DHT11温湿度采集,将DHT11采集到的温湿度显示到OLED屏幕上。

关键字: FPGA OLED屏幕

第八例啦,本例将介绍如何通过FPGA采集DS18B20传感器的温度值。

关键字: FPGA DS18B20传感器

这是FPGA之旅设计的第九例啦!!!本例将介绍如何使用FPGA驱动OLED屏幕,并在接下来的几例中,配合其它模块,进行一些有趣的综合实验。由于使用的OLED屏是IIC接口的,对IIC接口不是很清楚的,可以参考第五例的设计...

关键字: FPGA OLED屏幕

这是FPGA之旅设计的第十例啦,在上一例中,已经成功驱动了OLED屏幕,本例将结合上一例,以及第四例多bytes串口通信做一个有趣的例程。

关键字: FPGA OLED屏 串口

嵌入式教程

6897 篇文章

关注

发布文章

编辑精选

技术子站

关闭