世平集团推出 RockChip + Spreadtrum 3G智能手机方案

IDC 近期发布研究报告称，今年全球手机厂商的手机出货总量将会达到近 18 亿部, 预计今年智能手机的出货量将为 6.86 亿部，比去年增长 38.8%。现今智能手机多样化的功能，对越来越多的的用户来说，都日益成为一种更具吸引力的选择。

手机用户从功能手机到智能手机的过渡期仍将持续进行。在这个重要的变革时期，大联大旗下世平集团为推波助澜而推出RockChip + Spreadtrum 3G 智能手机方案，期能带给客户更多吸引力的商机。

方案框图：

主要芯片介绍：

Rockchip RK30XX

Features：

CPU

Dual-core Cortex-A9

1.2-1.5GHz

GPU

Mali-400MP GPU

Support OPENGL ES 1.1/2.0

High performance dedicated 2D/3D processor

VPU

1080p full-format video decoder

1080p video encoder for H.264/MVC/VP8

Interface

Support DDR3/LPDDR2 with high-perf

Embedded 60bits ECC, support MLC NAND Flash

Dual panel display

Dual camera supported

Embedded HDMI 1.4a

Rich peripheral and connectivity

Spreadtrum SC880xG

Features：

ARM926EJa 32-bit RISC processor, up to 550 MHz

High performance multi-layer AHB-Lite bus system and low power APB system

Signal processing for modem functions is mainly implemented in DSP sub system, and the embedded DSP sub-system includes

CEVA-Xa 1622 64 bit fixed point DSP core

The instruction set is VLIW and SIMD, optimized for communication and multi-media processing

System timing

For GSM/GPRS/EDGE, recommend usinga low swing 26 MHz master clock input. For TD-SCDMA, an on-chip PLL will provide specification required Rx/Tx clock

Programmable TDMA timing with 1/8 chip resolution in TD-SCDMA mode and 1/4 symbol resolution in GSM mode

Time tracking in power saving mode

Support inter-RAT handover: GSM/GPRS/EDGE to TD-SCDMA, as well as TD-SCDMA to GSM/GPRS/EDGE

16 general RFCTL wires for RF chip or antenna control

1 dedicated SPI ports for BB-RF chip communication

12-bit D/A converter with programmable gain for Automatic Frequency Control (AFC)

10-bit D/A converter with programmable gain

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