大联大友尚集团推出基于Invensense技术的智能手机OIS模块解决方案

21i讯，近日，大联大控股宣布，大联大友尚集团旗下富威推出基于Invensense IDG-2030(U)的智能手机OIS模块解决方案。Invensense IDG-2030(U)为最新一代二轴陀螺仪器件，是专门为了满足智能手机对拍照需求而设计的，其可提供光学防抖功能并增加照片清晰度。

手机相机模块已成为现在手机必备的功能之一，且已演变到超越5 Mega Pixel(MP)的高分辨率与高影像质量，未来将向超过8MP的更高质量发展。对高分辨率的青睐，延伸出市场对光学防手抖功能的需求，以防止低光线下的手抖(hand jitter)与各种光线下的摄影抖动(video jitter)所导致影像扭曲的现象产生。相机模块整合与执行器微定位技术(actuator technology)的发展，搭配Invensense小尺寸、高效能的陀螺仪，让移动便携设备上的相机模块能够直接拥有OIS功能，提供不输DSC的影像质量。

图示1-大联大友尚集团旗下富威代理的Invensense IDG-2030(U)的产品照片

大联大友尚集团旗下富威代理的Invensense的IDG-2030(U)为目前市场的最小尺寸(2.3*2.3*0.65)，可整合至最薄、最紧凑的模块中，并支持超音波水洗, 大大提高模块厂良率，是最适合整合至未来智能手机内的产品。Invensense单一结构陀螺仪设计，含单一驱动频率(single drive frequency)、高敏感度、高轴间隔绝、低相位延迟、低噪声、迅速的20MHz SPI接口，使Invensense的解决方案，可满足目前与下一代智能手机相机模块对OIS的需求。

图示2-大联大友尚集团旗下富威代理的Invensense IDG-2030(U)的应用框图

产品应用

• Optical Image Stabilization for Digital Still Camera and Video Cameras

• Electronic Image Stabilization for video jitter compensation

产品特性

1. Sensors

• Monolithic angular rate sensor (gyros) integrated circuit

• Available in XY (IDG-2030) versions

• Digital-output temperature sensor

• External sync signal connected to the FSYNC pin supports image, video and GPS synchronization

• Factory calibrated scale factor

• High cross-axis isolation via proprietary MEMS design

• 10,000g shock tolerant

2. Digital Output

• Fast Mode (400kHz) I2C serial interface

• 1 MHz SPI serial interface for full read/write capability

• 20 MHz SPI to read gyro sensor & temp sensor data

• 16-bit ADCs for digitizing sensor outputs

• User-programmable full-scale-range of ±31.25°/sec, ±62.5°/sec, ±125°/sec and ±250°/sec

3. Data Processing

• The total data set obtained by the device includes gyroscope data, temperature data, and the one bit external sync signal connected to the FSYNC pin

• FIFO allows burst read, reduces serial bus traffic and saves power on the system processor

• FIFO can be accessed through both I2C and SPI interfaces

• Programmable interrupt

• Programmable low-pass filters

4. Clocking

• On-chip timing generator clock frequency ±1% drift over full temperature range

5. Power

• VDD supply voltage range of 1.71V to 3.6V

• Flexible VDDIO reference voltage allows for multiple I2C and SPI interface voltage levels

• Power consumption for two axes active: 2.9mA

• Sleep mode: 5μA

• Each axis can be individually powered down

6. Package

• 2.3x2.3x0.65mm footprint and maximum thickness 16-pin QFN plastic package

• MEMS structure hermetically sealed at wafer level

• RoHS and Green compliant