TSMC加入SEMATECH 加速半导体技术开发

半导体制造商国际协会SEMATECH和全球领先的半导体代工企业TSMC近日共同宣布TSMC将加入SEMATECH成为

其核心成员。此次合作将关注于先进技术的开发，以应对一些产业面临的最严峻的挑战。

TSMC Joins SEMATECH to Accelerate Semiconductor Technology Development

Cooperation will focus on research and development for exploratory technologies on 20nm

generation and beyond

Albany, NY and HSINCHU, Taiwan – (May 11, 2011) – SEMATECH, the international consortium of

semiconductor manufacturers, and TSMC (TWSE: 2330, NYSE: TSM), a leading global semiconductor

foundry, today announced TSMC’s decision to join SEMATECH as a core member. The cooperation

will focus on advanced technology development to address some of the industry’s most

pressing challenges.

TSMC will join SEMATECH to collaborate on semiconductor research and development for IC

process technologies for 20nm generation and beyond, including extreme ultra-violet (EUV)

lithography, 3D interconnects, metrology, novel materials and device structures, and to

develop critical infrastructure vital for next-generation manufacturing, including the

transition to 450 mm wafer size.

SEMATECH's strong relationships with suppliers, chip makers, universities, and research

institutes around the world are a critical element in providing cutting-edge research and

development to its members. SEMATECH’s other core members include GlobalFoundries, HP, IBM,

Intel, Samsung, UMC, and the College of Nanoscale Science and Engineering (CNSE).

“This relationship further reflects our commitment to push the boundaries of innovation and

deliver leading-edge technology to our customers,” said Jack Sun, Vice President and CTO,

Research and Development of TSMC. “This complementary cooperation leverages SEMATECH’s

collaborative approach to lead critical industry technology transitions, with TSMC’s

position as an industry leader in advanced technology development and manufacturing.”

“We're excited that this agreement expands our long-standing relationship with TSMC and we

look forward to their contributions and technical insights from their perspective as a global

leader in advanced semiconductor technology and manufacturing,” said Dan Armbrust, president

and CEO of SEMATECH.? “TSMC will be an important partner in accelerating the progress of R&D

innovations and manufacturing solutions in leading edge technologies.”

SEMATECH manages an international network of world-leading collaborative partners, including

foundries, IDMs, fabless, packaging and assembly companies, and material and equipment

suppliers, to provide industry-wide solutions to the challenges of chip manufacturing.

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About TSMC

TSMC is the world’s largest dedicated semiconductor foundry, providing the industry’s

leading process technology and the foundry’s largest portfolio of process-proven libraries,

IPs, design tools and reference flows. The Company’s managed capacity in 2010 totaled 11.33

million (8-inch equivalent) wafers, including capacity from two advanced 12-inch GIGAFABs?,

four eight-inch fabs, one six-inch fab, as well as TSMC’s wholly owned subsidiaries,

WaferTech and TSMC China, and its joint venture fab, SSMC. TSMC is the first foundry to

provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For

more information about TSMC please visit http://www.tsmc.com.

About SEMATECH:

For over 20 years, SEMATECH? (www.sematech.org), the international consortium of leading

semiconductor manufacturers, has set global direction, enabled flexible collaboration, and

bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology

revolution with our nanoelectronics and emerging technology partners.

Press Contacts

SEMATECH Media Contact:

Erica McGill????

518-649-1041????

erica.mcgill@sematech.org

TSMC Acting Spokesperson

Elizabeth Sun

Director, Corporate Communication Division

Tel: 886-3-5682085

Email: elizabeth_sun@tsmc.com

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