当前位置:首页 > 汽车电子 > 汽车电子技术文库
[导读] ADI公司的ADM3055E是集成了隔离DC/DC转换器的5kVrms隔离的CAN物理层收发器,满足CAN灵活数据(FD)速率要求,可以工作高达5Mbps或更高,并和ISO 11898-2标准兼

ADI公司的ADM3055E是集成了隔离DC/DC转换器的5kVrms隔离的CAN物理层收发器,满足CAN灵活数据(FD)速率要求,可以工作高达5Mbps或更高,并和ISO 11898-2标准兼容.器件采用ADI的iCoupler®技术,把三路隔离器,CAN收发器和ADI isoPower® DC/DC转换器集成在SOIC表面安装封装中,工作电压5V,工作温度−40℃到 +105℃,主要用在CANOpen,DeviceNet和其它CAN总线应用,工业自动化,过程控制和建筑物控制以及交通运输和基础设备.本文介绍了ADM3055E主要特性和功能框图,以及评估板EVAL-ADM3055EEBZ主要特性,电路图,材料清单和PCB设计图.

The ADM3055E is a 5 kV rms isolated controller area network (CAN) physical layer transceiver with an integrated isolated dc-to-dc converter. The ADM3055E meets CAN flexible data (FD) rate requirements for operation to 5 Mbps and higher, and complies with the ISO 11898-2 standard.

The device employs Analog Devices, Inc., iCoupler® technology to combine a 3-channel isolator, a CAN transceiver, and Analog Devices isoPower® dc-to-dc converter into a single, small outline integrated circuit (SOIC), surface-mount package. The device is powered by a single 5 V supply realizing a fully isolated soluTIon for CAN and CAN FD applicaTIons. Radiated emissions from the high frequency switching of the dc-to-dc convertor are kept below EN 55022 Class B limits by conTInuous adjustments to the switching frequency.

The ADM3055E provides complete isolaTIon between the CAN controller and physical layer bus. Safety and regulatory approvals (pending) for 5 kV withstand voltage, 565 VPEAK working voltage, 10 kV surge test, and 8.3 mm creepage and clearance ensure that the ADM3055E meets application isolation requirements.

Low propagation delays through the isolation support longer bus cables. Slope control mode is available for standard CAN at low data rates. Standby mode minimizes power consumption when the bus is idle or if the node goes offline. Silent mode allows the TXD input to be ignored for listen only.

Dominant timeout functionality protects against bus lock up in a fault condition. The current limiting and thermal shutdown features protect against output short circuits. The device is fully specified over an industrial temperature range of −40℃to +105℃.

ADM3055E主要特性:

5 kV rms signal and power isolated CAN transceiver
isoPower integrated isolated dc-to-dc converter
VIO pin for 1.7 V to 5.5 V logic levels
ISO 11898-2: 2016 compliant (CAN FD)
Data rates up to 12 Mbps for CAN FD
Low maximum loop propagation delay: 150 ns
Extended common-mode range: ±25 V
Bus fault protection: ±40 V on CANH and CANL pins
Low power standby support remote wake request
Extra isolated signal for control (such as termination switches)
Passes EN 55022 Class B by 6 dB
Slope control for reduced EMI
Safety and regulatory approvals
VDE certificate of conformity, VDE V 0884-10 (pending): VIORM = 565 VPEAK
UL: 5000 V rms for 1 minute per UL 1577 (pending)
CSA Component Acceptance 5A at 5 kV rms (pending)
IEC 60950-1, IEC 61010-1
Creepage and clearance: 8.3 mm with 20-lead SOIC_IC
High common-mode transient immunity: >75 kV/μs
Industrial temperature range: −40℃to +105℃

ADM3055E应用:

CANOpen, DeviceNet, and other CAN bus applications
Industrial automation
Process control and building control
Transport and infrastructure


图1.ADM3055E功能框图

评估板EVAL-ADM3055EEBZ

The EVAL-ADM3055EEBZ allows the user to evaluate the ADM3055E isolated signal and power transceiver for controller area network (CAN) or CAN with flexible data rate (CAN FD) networks. The EVAL-ADM3055EEBZ allows all of the input and output functions to work without the need for external components. Based on the Analog Devices, Inc., iCoupler® technology, the ADM3055E integrates logic side on-off keying (OOK) signal isolation channels and an Analog Devices isoPower® dc-to-dc converter to provide regulated, isolated power that is well below CISPR22/EN55022 Class B limits when transmitting on a 2-layer printed circuit board (PCB) with ferrites. The EVAL-ADM3055EEBZ comes populated with an ADM3055E. Full specifications of the ADM3055E can be found in the ADM3055E data sheet, available from Analog Devices, Inc., and must be consulted in conjunction with this user guide when using the EVAL-ADM3055EEBZ.

评估板EVAL-ADM3055EEBZ主要特性:

ADM3055E with isoPower integrated, isolated, dc-to-dc converter
2-layer PCB with low radiated emissions, passes CISPR22/EN55022 Class B
On-board LDO for 6 V to 9 V supply, providing 5 V to the ADM3055E VCC pin
Screw terminal connectors for the following:
6 V to 9 V LDO, 5 V power supply to the VCC pin and the VIO pin
5 V direct power supply to VCC pin
1.8 V to 5.0 V direct power supply to the VIO pin
TXD pin, RXD pin, STBY pin, SILENT pin,
AUXIN pin, AUXOUT pin, and RS pin signals
Divided PCB return planes for GND1 and GND2
SMA connectors for TXD pin and RXD pin signals

评估板EVAL-ADM3055EEBZ包括:

EVAL-ADM3055EEBZ evaluation board
ADM3055EBRIZ
ADP7104
LTC6900


图2.评估板EVAL-ADM3055EEBZ外形图


图3.评估板EVAL-ADM3055EEBZ电路图
评估板EVAL-ADM3055EEBZ材料清单:


图4.评估板EVAL-ADM3055EEBZ PCB设计图(1):顶层丝印


图5.评估板EVAL-ADM3055EEBZ PCB设计图(2):顶层


图6.评估板EVAL-ADM3055EEBZ PCB设计图(3):底层


图7.评估板EVAL-ADM3055EEBZ PCB设计图(4):底层丝印


 

本站声明: 本文章由作者或相关机构授权发布,目的在于传递更多信息,并不代表本站赞同其观点,本站亦不保证或承诺内容真实性等。需要转载请联系该专栏作者,如若文章内容侵犯您的权益,请及时联系本站删除。
换一批
延伸阅读

随着信息技术的飞速发展,芯片作为现代电子设备的核心部件,其制作工艺流程的精密与复杂程度日益提高。芯片的制作,不仅仅是一系列技术操作的集合,更是一场探索微观世界的工艺之旅。本文将带领读者走进芯片制作的世界,揭示其大致工艺流...

关键字: 芯片 半导体

tda2030功放芯片将是下述内容的主要介绍对象,通过这篇文章,小编希望大家可以对它的相关情况以及信息有所认识和了解,详细内容如下。

关键字: tda2030 功放 芯片

本轮融资资金将用于已规模化供货的7纳米车规级芯片“龍鹰一号”的进一步量产和供货、基于“龍鹰一号”的高端智能座舱及舱行泊一体方案的市场推广,以及全场景高阶智驾新品AD1000的测试验证和市场导入。

关键字: 芯擎科技 芯片

3月26日,四维图新旗下杰发科技与国际第三方独立检测、检验和认证机构德国莱茵TÜV集团(以下简称TÜV莱茵)在上海举办颁证仪式,杰发科技宣布AC7840x系列车规级MCU芯片已成功通过ISO 26262 ASIL B功能...

关键字: 芯片 MCU 智能座舱

以下内容中,小编将对lm393芯片的相关内容进行着重介绍和阐述,希望本文能帮您增进对lm393芯片的了解,和小编一起来看看吧。

关键字: lm393 芯片

业内消息,近日被视为华为芯片“奠基人”的原海思总裁徐文伟近日在朋友圈宣布正式退休。徐文伟发文表示,自己在 33 年内,见证了一个伟大企业的发展和壮大。

关键字: 华为 芯片 海思 徐文伟

通过与北美J-Squared Technologies、南美Macnica DHW以及日本NEXTY Electronics三家企业深化合作,Hailo实现了迅速成长,并逐步拓宽了其全球商业版图。

关键字: 人工智能 处理器 芯片

近日外媒引述消息人士报道称,中国推出采购需求标准,或意味着中国将禁止政府电脑使用英特尔和超微半导体(AMD)CPU(处理器)芯片,截止目前英特尔和AMD尚未就此消息做出回应。

关键字: 英特尔 AMD 芯片

美国总统拜登日前宣布,随着美国政府加大力度将芯片制造片转移到本土,英特尔已经通过《芯片法案》获得高达85亿美元的资助。此外,该公司可以通过这一法案获得额外的110亿美元贷款。

关键字: 英特尔 芯片 半导体

近年来,全球范围内出现了芯片短缺的现象,对多个行业造成了显著影响。从汽车制造到电子设备生产,从通信领域到航空航天,几乎所有涉及芯片的行业都感受到了供应紧张的压力。那么,为何会出现芯片短缺的情况?本文将从多个角度深入剖析这...

关键字: 芯片 半导体
关闭
关闭