The STPMIC25 power-management IC for STM32MP2 microprocessors is now available, with 16 channels to supply all the MPU power rails as well as system peripherals in one convenient package. Completing the hardware design requires only a small number of external components to provide filtering and stabilization and the STEVAL-PMIC25V1 evaluation board is available now to start development immediately.
TS3121 and TS3121A rail-to-rail, open-drain, single channel comparators feature a novel failsafe architecture and guaranteed start-up time that simplify powering up for short periods to minimize consumption in low-power applications. Ideal for use in industrial controls, building automation, power tools, smart metering, as well as in automotive powertrain and body-control modules.
ST’s DCP3601 miniature monolithic buck converter combines extensive feature integration and flexibility, enabling simple, low-BOM designs to achieve high conversion efficiency. The power switches and compensation are built-in, requiring only six components to complete the circuit, including the inductor, bootstrap and filter capacitors, and feedback resistors for setting the output voltage.
STMicroelectronics’ TSC1801 low-side current-measurement amplifier integrates matched resistors to set the gain, which simplifies the circuit design, saves bill-of-materials costs, and ensures gain accuracy within 0.15% over the entire temperature range. The fixed gain also eliminates production trimming of external resistors.
STPOWER MDmesh DM9 AG automotive-grade 600V/650V super-junction MOSFETs deliver high efficiency and ruggedness for on-board chargers and DC/DC converters in both hard- and soft-switching topologies.
Accelerating the design of gallium-nitride (GaN) power supplies (PSUs) that deliver superior efficiency and power density, STMicroelectronics has launched the EVL250WMG1L resonant-converter reference design based on the MasterGaN1L System-in-Package (SiP).
ST’s VIPerGaN65D flyback converter, with its SOIC16 outline, permits extremely small and economical power supplies, adapters, and USB-PD (Power Delivery) fast chargers up to 65W with universal input voltage.
2025年6月5日，中国——意法半导体宣布Wi-Fi 6和低功耗蓝牙 5.4二合一模块ST67W611M1正式进入量产阶段，与此同时，重要客户Siana采用该模块的设计项目已取得初步成功，大大缩短了无线连接解决方案的研发周期。
2025年5月29日，中国--服务多重电子应用领域、全球排名前列的半导体公司意法半导体(STMicroelectronics，简称ST;纽约证券交易所代码:STM)日前宣布与新加坡科技研究局微电子研究所 (A*STAR IME) 和爱发科 (ULVAC) 合作，共同拓展意法半导体在新加坡的“厂内实验室”(LiF)合作项目。新一期项目包括与新加坡科技研究局材料研究与工程研究所 (A*STAR IMRE) 以及新加坡国立大学 (NUS)的合作项目。
意法半导体（ST）成立于1988年6月，由意大利SGS微电子公司和法国Thomson半导体公司合并而成，是半导体工业最具创新力的公司之一。
